5SGXEA9N3F45C2N

The 5SGXEA9N3F45C2N is a Stratix® V GX family FPGA from Intel, supplied in a 1932-ball BGA (FCBGA) package. This commercial-grade device provides a large logic fabric, substantial on-chip RAM, and a high-density I/O complement for complex, programmable hardware designs.

Key attributes include 840,000 logic elements, approximately 53.25 Mbits of embedded memory, and 840 I/O pins. The device is specified for surface-mount assembly with a core supply range of 870 mV to 930 mV and an operating temperature of 0 °C to 85 °C.

Key Features

• Logic Capacity — 840,000 logic elements to implement large-scale programmable logic and custom datapaths.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
• I/O Density — 840 I/O pins to support high pin-count interfacing and multi-channel connectivity.
• Package and Mounting — 1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45); surface-mount device for PCB assembly.
• Power Supply — Core supply voltage range of 870 mV to 930 mV to match platform power architectures.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial applications.
• Standards Compliance — RoHS compliant.
• Series-Level Documentation — The Stratix V device datasheet documents core and transceiver speed grading and electrical characteristics for the Stratix V family.

Typical Applications

• High-density programmable logic — Implement large custom logic networks and complex control state machines using the device’s 840,000 logic elements.
• Memory-intensive functions — Use approximately 53.25 Mbits of embedded RAM for buffering, packet handling, or algorithmic storage.
• High-pin-count interfacing — Leverage 840 I/O pins for multi-channel data acquisition, parallel buses, and dense peripheral connectivity.

Unique Advantages

• High integration density: 840,000 logic elements reduce the need for external glue logic and discrete programmable devices.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM supports larger local buffers and state storage without external memory.
• Extensive I/O capability: 840 I/O pins provide flexibility for routing many signals or multiple high-bandwidth channels.
• Compact, production-ready package: 1932-BBGA (45×45) in a surface-mount form factor suitable for dense PCB layouts.
• Controlled core voltage: Narrow core supply window (870 mV–930 mV) for predictable power and thermal planning.
• Commercial temperature rating: Specified operation from 0 °C to 85 °C for standard commercial environments.

Why Choose 5SGXEA9N3F45C2N?

The 5SGXEA9N3F45C2N delivers a combination of large logic capacity, significant embedded memory, and high I/O density in a production-ready BGA package. Its specifications make it suitable for designs that require dense programmable logic, substantial on-chip buffering, and broad interfacing capabilities within commercial temperature ranges.

Backed by the Stratix V family datasheet and Intel’s device documentation, this device is appropriate for development teams seeking a high-capacity FPGA platform with well-documented electrical characteristics and packaging information to support board-level design and integration.

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