5SGXEA9N3F45C4N

The 5SGXEA9N3F45C4N is an Intel Stratix V GX field-programmable gate array (FPGA) in a 1932-BBGA FCBGA package. It provides a high logic density fabric and substantial on-chip memory for commercial applications that require large-scale programmable logic and extensive I/O integration. With a core supply range of 0.82–0.88 V and a commercial operating temperature range of 0 °C to 85 °C, this device is targeted at designs that need high-density logic, abundant embedded RAM, and a large number of I/Os in a surface-mount footprint.

Key Features

• Core Logic 840,000 logic elements for implementing complex programmable logic and large-scale digital designs.
• Embedded Memory Approximately 53.25 Mbits of embedded memory available for buffering, FIFOs, and on-chip storage.
• I/O Capacity 840 user I/O pins to support wide parallel interfaces, multi-lane connectivity, and rich peripheral integration.
• Power Domain Core voltage supply specified from 820 mV to 880 mV to match targeted power delivery and FPGA core requirements.
• Package & Mounting 1932-BBGA, FCBGA package (supplier package: 1932-FBGA, FC 45×45) in a surface-mount configuration for board-level integration.
• Temperature & Grade Commercial-grade device rated for 0 °C to 85 °C operation.
• Regulatory RoHS compliant.

Typical Applications

• High-density digital processing — Implement complex state machines, custom datapaths, and parallel processing pipelines using the large logic element count and on-chip memory.
• High-port-count I/O systems — Support boards and subsystems that require many external interfaces or wide parallel buses with 840 I/Os.
• Commercial communications and compute modules — Integrate into systems where substantial programmable logic and embedded memory enable protocol handling, packet processing, or control functions in commercial environments.

Unique Advantages

• High logic density: 840,000 logic elements allow consolidation of large designs into a single FPGA, reducing system complexity and board-level BOM.
• Generous on-chip memory: Approximately 53.25 Mbits of embedded RAM supports buffering, local data storage, and efficient data-path implementations without external memory.
• Extensive I/O count: 840 I/O pins enable rich external connectivity and support for multiple parallel interfaces or many peripheral devices.
• Compact, board-ready package: 1932-BBGA FCBGA in a surface-mount form factor simplifies board integration for compact, high-density PCBs.
• Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for use in commercial product lines.
• Controlled core voltage: Narrow core supply window (0.82–0.88 V) supports predictable power design and VCC planning for the FPGA core.

Why Choose 5SGXEA9N3F45C4N?

The 5SGXEA9N3F45C4N delivers a combination of very high logic capacity, substantial embedded memory, and a large I/O complement in a single commercial-grade Stratix V GX device. It is well suited to engineers and system designers consolidating complex logic roles onto one FPGA to reduce board-level components and simplify interconnect.

With a surface-mount 1932-BBGA package and controlled core-voltage requirements, this device provides a compact, board-ready option for commercial applications that demand high-density programmable logic, ample on-chip RAM, and broad interface capability while maintaining RoHS compliance.

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