5SGXEA9N3F45I3LG

The 5SGXEA9N3F45I3LG is an Intel Stratix V GX Field Programmable Gate Array (FPGA) offered in an industrial temperature grade. It provides a high logic capacity FPGA core with documented electrical and switching characteristics suitable for designs that require large on‑chip memory, extensive I/O, and high‑speed transceiver capability.

This device is targeted at applications needing dense programmable logic and high I/O count in a surface‑mount FCBGA package, with operating parameters and transceiver speed grades described in the device datasheet.

Key Features

• Core logic — 840,000 logic elements (cells) to implement complex, high‑density logic designs.
• Embedded memory — approximately 53.25 Mbits of on‑chip RAM to support large buffering and local storage.
• I/O density — 840 I/O pins to support multi‑lane interfaces and rich peripheral connectivity.
• High‑speed transceivers — Stratix V GX transceiver capabilities described in the datasheet, with GX channel speed grades listed up to 14.1 Gbps depending on speed grade.
• Package — Surface‑mount 1932‑BBGA (FCBGA / 1932‑FBGA, FC 45×45) package for high‑pin‑count, board‑level integration.
• Power — Core supply voltage range: 820 mV to 880 mV.
• Industrial temperature grade — Rated operating temperature: −40°C to 100°C for deployment in demanding environments.
• Documented electrical and timing characteristics — Device datasheet includes electrical, switching, I/O timing, and transceiver specifications to support design and validation.

Typical Applications

• High‑speed serial interface designs — Leverage Stratix V GX transceiver speed grades (up to 14.1 Gbps) and abundant I/O for multi‑lane serial links and high‑bandwidth transport.
• High‑density logic consolidation — Use 840,000 logic elements and substantial on‑chip RAM to integrate complex digital functions and reduce external components.
• Industrial control and instrumentation — Industrial temperature rating (−40°C to 100°C) and high I/O count make it suitable for embedded control and data‑acquisition systems.
• System prototyping and integration — Large logic capacity and surface‑mount FCBGA package support advanced prototyping and compact system integration.

Unique Advantages

• High integration density: 840,000 logic elements and ~53.25 Mbits of embedded RAM reduce the need for external logic and memory components.
• Extensive I/O capability: 840 I/O pins enable complex multi‑channel interfaces and flexible board routing.
• High‑speed serial support: Stratix V GX transceiver speed grades (documented in the datasheet) provide options for demanding serial communications.
• Industrial temperature range: −40°C to 100°C operation supports deployment in temperature‑sensitive and industrial environments.
• Compact, high‑pin‑count packaging: 1932‑BBGA (FCBGA) 45×45 package allows dense board integration while accommodating the device’s high I/O count.
• Well‑documented device characteristics: Electrical and switching characteristics, including I/O timing and programmable delays, are provided in the device datasheet to aid design and validation.

Why Choose 5SGXEA9N3F45I3LG?

5SGXEA9N3F45I3LG positions itself as a high‑capacity Stratix V GX FPGA for designs requiring substantial programmable logic, large embedded memory, and extensive I/O in an industrial temperature grade. Its documented electrical and switching specifications, including transceiver speed grades, give engineers the information needed to architect reliable systems.

This device is suited for teams consolidating complex functions into a single FPGA, implementing high‑bandwidth serial links, or building industrially rated embedded systems. The combination of logic density, on‑chip RAM, I/O count, and package density offers a scalable option for advanced digital designs.

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