5SGXEA9N3F45I4N

The 5SGXEA9N3F45I4N is a Stratix V GX field‑programmable gate array (FPGA) device designed for high‑density, high‑I/O applications. This industrial‑grade, surface‑mount FPGA provides a large logic fabric, substantial on‑chip memory, and broad I/O capability in a compact 1932‑FBGA package.

Targeted at systems requiring significant programmable logic and connectivity, the device is suited to applications that benefit from abundant logic elements, extensive embedded memory, and operation across an industrial temperature range.

Key Features

• Logic Capacity  Provides 840,000 logic elements for complex programmable logic and high‑density designs.
• Embedded Memory  Includes approximately 53.25 Mbits of on‑chip RAM to support large buffering and fast local storage.
• I/O Resources  Delivers 840 general I/O pins to support wide connectivity and parallel interfaces.
• Power Envelope  Core voltage supply range of 820 mV to 880 mV for the device core domain.
• Package & Mounting  Available in a 1932‑BBGA (FCBGA) package; supplier package listed as 1932‑FBGA, FC (45×45). Surface‑mount mounting type for standard PCB assembly.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in temperature‑challenging environments.
• Regulatory Compliance  RoHS‑compliant construction.
• Family Heritage  Part of the Stratix V GX device family as described in the device datasheet series.

Typical Applications

• High‑performance data processing  Leverage the large logic element count and on‑chip RAM for complex custom accelerators and data path implementations.
• Communications and networking  Use extensive I/O and Stratix V GX family transceiver capability for high‑bandwidth interface implementations and protocol handling.
• Industrial control and instrumentation  Industrial temperature rating and large I/O make the device suitable for control systems, signal aggregation, and processing at the edge.

Unique Advantages

• High logic density: 840,000 logic elements enable sophisticated functions and deep pipeline architectures without external logic expansion.
• Substantial on‑chip memory: Approximately 53.25 Mbits of embedded RAM reduces dependence on off‑chip memory for buffering and local data storage.
• Extensive I/O count: 840 I/Os support rich interface options and parallel connectivity for complex system integration.
• Industrial temperature range: Rated from −40 °C to 100 °C for reliable operation in harsh and outdoor environments.
• Compact, industry‑standard package: 1932‑FBGA (45×45) FCBGA offers high pin density in a surface‑mount form factor for space‑constrained PCBs.
• Controlled core voltage: Core supply specified between 820 mV and 880 mV to match system power‑delivery design and regulation.

Why Choose 5SGXEA9N3F45I4N?

The 5SGXEA9N3F45I4N combines a very large logic resource pool with substantial embedded memory and a high I/O count in an industrial‑rated, RoHS‑compliant FCBGA package. It is positioned for engineers building high‑density, high‑connectivity systems that require a programmable platform capable of sustained operation across a wide temperature range.

This device suits development teams and production designs that need scalable FPGA capacity, significant local memory for low‑latency data handling, and robust I/O capability—all within a compact surface‑mount package supported by the Stratix V GX device family documentation.

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