5SGXEA9N3F45I3LN

The 5SGXEA9N3F45I3LN is a Stratix® V GX field programmable gate array from Intel (Altera) provided in a 1932-BBGA FCBGA package for surface-mount board assembly. The device integrates large programmable logic capacity, substantial on-chip RAM, and a high I/O count to address designs that require dense programmable logic and extensive I/O connectivity.

Key device parameters include 840,000 logic elements, approximately 53.25 Mbits of embedded memory, 840 I/Os, industrial temperature grading, and a core voltage range of 820 mV to 880 mV.

Key Features

• Programmable Logic Capacity  840,000 logic elements (cells) provide large-scale programmable resources for complex digital logic implementations.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support buffering, on-chip data storage, and state retention for large designs.
• I/O Density  840 general-purpose I/Os support extensive external connectivity and high pin-count interfaces.
• Package & Mounting  1932-BBGA (FCBGA) package, supplier device package 1932-FBGA, FC (45×45), designed for surface-mount assembly.
• Voltage Supply  Core supply range specified at 820 mV to 880 mV for device operation.
• Temperature Grade  Industrial operating range from −40 °C to 100 °C for deployment in extended-temperature environments.
• Regulatory Compliance  RoHS compliant, supporting lead-free manufacturing requirements.

Typical Applications

• High-density programmable logic systems  Use the device where large numbers of logic elements and substantial on-chip RAM are required for complex FPGA designs.
• High I/O-count interface platforms  Ideal for systems that need broad external connectivity and many parallel interfaces, leveraging the 840 available I/Os.
• Industrial embedded systems  Suitable for industrial-grade equipment operating across −40 °C to 100 °C that require robust, programmable logic capacity.

Unique Advantages

• Large logic fabric: 840,000 logic elements deliver substantial programmable resources to implement complex functions on a single device.
• Significant on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces external memory dependency for many buffering and storage needs.
• Extensive I/O capability: 840 I/Os enable dense external interconnects and multi-channel interfacing without requiring additional I/O expansion.
• Industrial temperature rating: Operation from −40 °C to 100 °C supports deployment in controlled and extended-temperature industrial environments.
• Compact BGA footprint: 1932-BBGA (45×45) package offers a high-density package option optimized for surface-mount assembly.
• Low-voltage core: 820 mV to 880 mV supply range helps define power delivery and thermal considerations for board-level design.

Why Choose 5SGXEA9N3F45I3LN?

The 5SGXEA9N3F45I3LN positions itself as a high-capacity Stratix V GX FPGA option combining 840,000 logic elements, substantial embedded memory, and a high I/O count within a single 1932-BBGA surface-mount package. Its industrial temperature rating and RoHS compliance make it suitable for demanding embedded and industrial applications that require on-chip resources and extended operating conditions.

This device is appropriate for designers and teams targeting complex programmable logic implementations that benefit from large on-chip RAM, dense I/O, and the form factor of a 1932-BBGA FCBGA package, with documented specifications available in the Stratix V device datasheet.

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