5SGXEA9N3F45I3G

The 5SGXEA9N3F45I3G is a Stratix V GX family FPGA offering very-high logic and memory density in a 1932-ball FCBGA package. It provides a broad mix of programmable logic, on-chip RAM, and a large I/O count for demanding industrial designs.

Designed for applications that require high integration and robust thermal performance, this industrial-grade device delivers 840,000 logic elements, approximately 53.25 Mbits of embedded memory, and 840 I/O resources while operating over an extended temperature and low-voltage core range.

Key Features

• Programmable Logic: 840,000 logic elements provide substantial capacity for complex RTL, custom accelerators, and wide datapath implementations.
• Logic Array Blocks: 317,000 logic blocks (configuration units) enabling large-scale logic partitioning and resource allocation.
• Embedded Memory: Approximately 53.25 Mbits of on-chip RAM to support large buffers, FIFOs, and local data storage.
• I/O Density: 840 user I/Os for high-pin-count interfacing and multi-channel connectivity.
• Power and Core Voltage: Core voltage supply specified from 820 mV to 880 mV to support the device’s operating envelope.
• Package & Mounting: 1932-BBGA (FCBGA) package — supplier device package listed as 1932-FBGA, FC (45×45) — with surface-mount assembly.
• Temperature & Grade: Industrial grade operation from −40 °C to 100 °C for deployment in temperature-challenged environments.
• Environmental Compliance: RoHS compliant.
• Stratix V GX Family Characteristics: As part of the Stratix V GX devices, the family includes multiple core and transceiver speed grades for applications requiring high-speed serial channels (refer to family datasheet for details).

Typical Applications

• High-density compute and acceleration: Large logic and memory resources enable custom accelerators, streaming datapaths, and compute-intensive functions that benefit from on-chip RAM and extensive logic.
• Multi-channel I/O systems: High I/O count supports designs that require numerous parallel interfaces or multiple protocol endpoints within a single device.
• Industrial control and instrumentation: Industrial temperature rating and robust packaging suit control systems and instrumentation that operate across wide temperature ranges.
• High-throughput serial connectivity: As a Stratix V GX family device, it supports transceiver speed grades within the family for multi-gigabit channel implementations (see series datasheet for specific transceiver options).

Unique Advantages

• High logic capacity: 840,000 logic elements reduce the need for multiple devices, simplifying system design and lowering board-level complexity.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM enables large buffer and packet processing without external memory dependence.
• Extensive I/O: 840 I/Os allow dense connectivity and flexible interfacing across numerous peripherals and high-channel-count applications.
• Industrial-grade operation: −40 °C to 100 °C rating supports deployment in environments with wide temperature swings.
• Compact, production-ready package: 1932-ball FCBGA surface-mount package provides a high pin-count solution in a defined footprint for volume production.
• Standards-conscious compliance: RoHS compliance meets common environmental requirements for modern electronics production.

Why Choose 5SGXEA9N3F45I3G?

5SGXEA9N3F45I3G positions itself for designs that demand very high programmable logic capacity, significant embedded RAM, and large I/O resources within an industrial-grade FPGA platform. The combination of 840,000 logic elements, roughly 53.25 Mbits of on-chip memory, and 840 I/Os makes it suitable for complex, high-integration systems where consolidation and on-chip throughput matter.

This device is suited for engineering teams building scalable, robust designs that require dense logic, substantial local memory, and broad interfacing capability in a production-oriented package and temperature range. Refer to the Stratix V GX family documentation for detailed device-level speed grades and transceiver options when evaluating fit for multi-gigabit channel requirements.

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