5SGXEA9N3F45I3N

The 5SGXEA9N3F45I3N is an Intel Stratix® V GX Field Programmable Gate Array (FPGA) provided in a 1932-ball BGA FCBGA package. This industrial-grade device delivers very high logic density and on-chip memory in a surface-mount package designed for complex, high-density FPGA implementations.

With 840,000 logic elements, approximately 53.25 Mbits of embedded RAM and 840 I/O, this device targets applications that require substantial programmable logic, large embedded memory resources, and extensive I/O connectivity while operating across an industrial temperature range.

Key Features

• Logic Capacity  Provides 840,000 logic elements for implementing large-scale programmable logic, state machines, and datapath resources.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support buffering, FIFOs, and large on-chip data structures.
• I/O Density  840 I/O pins to support high pin-count interfaces and board-level connectivity.
• Power Supply  Core voltage supply range from 820 mV to 880 mV to match Stratix V core power requirements.
• Package & Mounting  1932-BBGA FCBGA package (supplier package: 1932-FBGA, FC (45×45)), delivered in a surface-mount format for compact board integration.
• Operating Range & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C for robust performance in demanding environments.
• Standards Compliance  RoHS compliant for compatibility with modern manufacturing and environmental requirements.

Typical Applications

• High-density digital systems  Use the large logic capacity and embedded RAM for complex datapath implementations, parallel processing, and custom accelerators.
• Networking & communications  Leverage high I/O count and family-level transceiver capabilities (Stratix V GX family) for packet processing, switching, and protocol offload tasks.
• Data center and compute acceleration  Deploy as a programmable fabric for hardware acceleration, buffering and protocol adaptation where large on-chip memory and logic are required.

Unique Advantages

• High logic density: 840,000 logic elements enable consolidation of multi-function designs into a single FPGA, reducing board-level complexity.
• Substantial on-chip RAM: Approximately 53.25 Mbits of embedded memory supports large buffers and high-throughput streaming without relying on external memory.
• Extensive I/O: 840 I/O pins provide flexibility for multiple interfaces and high channel counts on a single device.
• Industrial operation: Rated for −40 °C to 100 °C, making it suitable for industrial environments requiring wider temperature tolerance.
• Compact, manufacturable package: 1932-ball FCBGA (45×45) surface-mount package offers a high pin count in a compact footprint for dense board-level integration.
• RoHS compliant: Aligns with environmental and manufacturing requirements for modern electronics production.

Why Choose 5SGXEA9N3F45I3N?

The 5SGXEA9N3F45I3N positions itself as a robust, industrial-grade Stratix V GX FPGA option for designs that demand very high logic and memory capacity with broad I/O connectivity. Its combination of 840,000 logic elements, roughly 53.25 Mbits of embedded RAM, and 840 I/O make it well suited to complex, high-density FPGA implementations in networking, compute acceleration, and other performance-focused systems.

Engineers specifying this device benefit from a compact 1932-BBGA surface-mount package and an operating voltage and temperature range aligned with industrial deployments, while maintaining compliance with RoHS requirements for modern production environments.

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