5SGXEABK1H40C2L

The 5SGXEABK1H40C2L is a Stratix® V GX field-programmable gate array (FPGA) offered by Intel. It delivers very high logic density and on-chip memory capacity in a 1517-BBGA FCBGA footprint, addressing designs that require large programmable logic fabrics with substantial I/O and embedded RAM resources.

Engineered for commercial applications, this device combines 952,000 logic elements, approximately 53.25 Mbits of embedded memory, and 696 I/O to support complex, high‑integration FPGA designs while operating within a commercial temperature range.

Key Features

• Core Logic  952,000 logic elements (logic cells) provide a very high-density programmable fabric for complex logic, control and data-path implementations.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-intensive logic functions.
• I/O Capacity  696 user I/O pins to support wide parallel interfaces, high-pin-count peripherals and extensive system connectivity.
• Package & Mounting  1517-BBGA (FCBGA) package; supplier device package listed as 1517-HBGA (45×45). Surface-mount mounting type for standard board-level assembly.
• Power Supply  Core voltage supply range 820 mV to 880 mV, enabling operation within a tight low-voltage core domain.
• Temperature & Grade  Commercial-grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance  RoHS compliant.
• Series Documentation  Part of the Stratix V family; series datasheet provides electrical and switching characteristics, I/O timing guidance and speed-grade information for GX devices.

Typical Applications

• High-density digital systems  For designs that require a large programmable fabric and significant on-chip RAM to implement complex algorithms and data-path processing.
• High I/O aggregation  Useful where hundreds of external signals must be routed, buffered or protocol-handled directly by the FPGA.
• Commercial embedded platforms  Suited to commercial-temperature embedded products that need scalable logic resources and substantial memory in a compact BGA package.

Unique Advantages

• High logic density: 952,000 logic elements reduce the need for multi-chip solutions by consolidating large designs into a single device.
• Large embedded memory: Approximately 53.25 Mbits of on-chip RAM supports data buffering and memory‑intensive logic without external memory for many applications.
• Extensive I/O: 696 I/O pins allow broad peripheral connectivity and wide parallel interfaces for system integration.
• Compact, manufacturable package: 1517-BBGA FCBGA surface-mount package supports high-density board layouts while providing the pin count required by demanding designs.
• Commercial temperature rating: Rated 0 °C to 85 °C for applications targeted at commercial environments.
• Regulatory friendliness: RoHS compliance simplifies environmental and manufacturing considerations.

Why Choose 5SGXEABK1H40C2L?

The 5SGXEABK1H40C2L positions itself as a high-density, high‑integration Stratix V GX FPGA for commercial applications that demand a large number of logic elements, substantial embedded RAM and wide I/O capability in a compact BGA package. Its low-voltage core range and packaged form factor make it suitable for designs prioritizing integration and board-level density.

Designers seeking to consolidate complex logic and memory workloads into a single programmable device will find this Stratix V GX part well suited to commercial embedded platforms, high I/O aggregation tasks and other applications that benefit from large on-chip resources and comprehensive series documentation.

Request a quote or submit a request for price and availability for part number 5SGXEABK1H40C2L to obtain lead time and procurement details.