5SGXEABK1H40C2LG

The 5SGXEABK1H40C2LG is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel designed for high-density, high-capacity digital designs. It combines extensive programmable logic, significant embedded RAM, and a large I/O count in a high-pin-count FCBGA package.

This commercial-grade device is suited to designs that require large logic capacity, substantial on-chip memory, and a compact surface-mount 1517-BBGA footprint while operating from a low-voltage core supply.

Key Features

• High-density logic — 952,000 logic elements to implement complex digital functions and large-scale FPGA designs.
• Embedded memory — Approximately 53 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive processing without external memory.
• I/O capacity — 696 I/O pins for broad system interfacing and high channel count connectivity.
• Low-voltage core — Core supply range of 820 mV to 880 mV for operation at optimized core voltages.
• Package & mounting — 1517-BBGA (FCBGA) package, supplier package 1517-HBGA (45×45), surface-mount mounting for compact, high-density board designs.
• Commercial temperature grade — Rated for 0 °C to 85 °C operation suitable for standard commercial applications.
• RoHS compliant — Meets RoHS environmental requirements for lead-free assembly.
• Stratix V family documentation — Device electrical and switching characteristics are documented in the Stratix V device datasheet for integration and design reference.

Typical Applications

• High-density digital processing — Implement complex RTL and hardware-accelerated functions using the device’s 952,000 logic elements and large embedded memory.
• Memory-intensive algorithms — On-chip ~53 Mbits of RAM supports buffering, packet processing, and dataflow architectures with reduced external memory dependency.
• Multi-channel I/O systems — 696 I/Os enable dense sensor, control, or peripheral interfaces within a single FPGA footprint.
• Compact, high-pin-count board designs — The 1517-BBGA FCBGA package delivers a high-pin-count solution in a surface-mount form factor for space-constrained PCBs.

Unique Advantages

• Large programmable capacity: 952,000 logic elements allow integration of multiple subsystems on a single device, reducing BOM and interconnect complexity.
• Substantial on-chip memory: Approximately 53 Mbits of embedded RAM enables memory-heavy processing locally on the FPGA, improving latency and throughput.
• Extensive I/O integration: 696 I/Os support high channel counts and flexible board-level partitioning to simplify system architecture.
• High-pin-count package: The 1517-BBGA (45×45) FCBGA package provides dense routing capability for complex designs in a surface-mount footprint.
• Commercial-grade operation: Rated for 0 °C to 85 °C, suited for a wide range of commercial electronics applications.
• Standards-compliant supply chain: RoHS compliance supports lead-free manufacturing and regulatory requirements.

Why Choose 5SGXEABK1H40C2LG?

The 5SGXEABK1H40C2LG Stratix V GX FPGA delivers a combination of very high logic density, significant embedded RAM, and a large I/O count in a compact FCBGA package—helpful for consolidating complex functions and reducing board-level component count. Its low-voltage core operation and commercial temperature rating make it a practical choice for demanding commercial designs that require scalable programmable logic with extensive on-chip resources.

Supported by the Stratix V device documentation, this FPGA is appropriate for teams that need detailed device electrical and switching characteristics during integration and validation. It is well suited to design projects focused on integrating dense digital logic, high-throughput data handling, and extensive I/O within a single programmable device.

Request a quote or submit a procurement inquiry to evaluate the 5SGXEABK1H40C2LG for your next high-density FPGA design project.