5SGXEABK1H40C2G

IC FPGA 696 I/O 1517HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 53248000 952000 1517-BBGA, FCBGA

Quantity 1,154 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-HBGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs359200Number of Logic Elements/Cells952000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXEABK1H40C2G – Stratix® V GX Field Programmable Gate Array (FPGA), 952,000 logic elements, ~53.25 Mbits RAM, 696 I/O, 1517-BBGA

The 5SGXEABK1H40C2G is a Stratix® V GX series Field Programmable Gate Array (FPGA) optimized for high-density logic and large on‑chip memory requirements. This commercial‑grade FPGA combines a substantial logic fabric with abundant embedded RAM and a high I/O count to support complex, memory‑intensive designs.

Key attributes include 952,000 logic elements, approximately 53.25 Mbits of embedded memory, 696 user I/O, and a 1517‑BBGA FCBGA package. The device operates from 870 mV to 930 mV core supply and is specified for 0 °C to 85 °C operation.

Key Features

  • Core Logic  952,000 logic elements provide a large, flexible fabric for implementing complex digital functions and custom hardware accelerators.
  • Embedded Memory  Approximately 53.25 Mbits of on‑chip RAM to support buffering, tables, and high‑bandwidth local storage without external memory dependencies.
  • High I/O Count  696 general‑purpose I/O pins enable extensive board‑level connectivity and broad peripheral interfacing options.
  • Power and Voltage  Core supply range of 870 mV to 930 mV supports the device’s specified operating conditions for power delivery and planning.
  • Package and Mounting  1517‑BBGA (FCBGA) package; supplier device package listed as 1517‑HBGA (45×45). Surface‑mount mounting type for standard PCB assembly flows.
  • Temperature and Grade  Commercial grade operation over 0 °C to 85 °C for applications targeted at commercial environments.
  • Standards Compliance  RoHS compliant, supporting regulatory and environmental requirements for lead‑free assemblies.

Typical Applications

  • High‑density digital systems  Implement large custom logic designs and hardware accelerators using the device’s extensive logic element count and embedded RAM.
  • Memory‑intensive processing  Use the substantial on‑chip RAM for buffering, lookup tables, and on‑die data handling to reduce external memory bandwidth needs.
  • High‑I/O interface designs  Leverage 696 I/O pins for dense board connectivity, multiple peripheral interfaces, and complex system integration.

Unique Advantages

  • Large programmable fabric: 952,000 logic elements enable consolidation of multi‑module designs onto a single FPGA, reducing BOM and board complexity.
  • Substantial on‑chip memory: Approximately 53.25 Mbits of embedded RAM supports local data staging and high‑performance buffering without immediate reliance on off‑chip memory.
  • Extensive I/O capacity: 696 I/O pins simplify system partitioning by providing ample signals for peripherals, interfaces, and board‑level routing.
  • Commercial temperature suitability: Rated for 0 °C to 85 °C, matching typical commercial systems and controlled ambient environments.
  • Surface‑mount BGA packaging: 1517‑BBGA FCBGA package supports high‑density PCB layouts and standard SMT assembly processes.
  • Regulatory readiness: RoHS compliance helps meet environmental requirements for modern electronic assemblies.

Why Choose 5SGXEABK1H40C2G?

The 5SGXEABK1H40C2G delivers a combination of high logic density, ample embedded memory, and broad I/O resources in a commercial‑grade Stratix V GX device. Its specification set is suited to engineers and procurement teams designing compact, memory‑heavy digital systems that require substantial on‑chip resources and extensive external interfacing.

This device is a practical choice for designs that demand integration of large logic functions and significant local storage while maintaining standard board assembly and commercial operating temperature requirements. Its inclusion in the Stratix V GX family provides access to ecosystem documentation and device‑level electrical characteristics for detailed system design and validation.

Request a quote or submit an inquiry to evaluate 5SGXEABK1H40C2G for your next high‑density FPGA design project.

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