5SGXEABK1H40C2LN

The 5SGXEABK1H40C2LN is a Stratix V GX field-programmable gate array (FPGA) from Intel offering high on-chip logic and memory capacity in a BGA package. It provides a combination of large logic resources, substantial embedded RAM, and a high I/O count for dense programmable designs.

Targeted at commercial-temperature applications, this surface-mount device is supplied with a narrow core voltage range and is RoHS compliant, making it suitable for designs that require controlled power domains and high integration density.

Key Features

• Core Logic — 952,000 logic elements for large-scale digital implementations and complex programmable logic integration.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-mapped data structures without external memory for many use cases.
• I/O Capacity — 696 user I/O pins to handle wide parallel interfaces, multiple high-pin-count peripherals, and extensive board-level routing.
• Power Supply — Core voltage supply specified at 820 mV to 880 mV to support the device’s operating requirements.
• Package & Mounting — 1517‑BBGA (FCBGA) package; supplier device package listed as 1517‑HBGA (45×45). Surface-mount mounting type suitable for standard PCB assembly.
• Operating Grade & Temperature — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• High-density digital systems — Use the large logic resource and on-chip RAM to implement complex control, signal processing, and protocol logic without excessive external glue logic.
• Multi-interface bridging — Leverage 696 I/Os to connect and translate between numerous parallel and serial interfaces on a single device.
• Data buffering and acceleration — The substantial embedded memory supports large buffering, pipeline stages, and acceleration engines integrated on-chip.

Unique Advantages

• Massive logic capacity: 952,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level component count.
• Significant on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces dependence on external memory for many data-path and control applications.
• High I/O density: 696 I/Os simplify system-level connectivity, allowing complex front-end and back-end interfacing from a single device.
• Compact BGA package: 1517‑BBGA/1517‑HBGA (45×45) packaging provides a high-pin-count solution in a surface-mount form factor for space-constrained designs.
• Commercial-grade availability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.

Why Choose 5SGXEABK1H40C2LN?

This Intel Stratix V GX FPGA part delivers a high degree of integration for complex digital designs that require extensive logic, embedded memory, and I/O connectivity. Its combination of 952,000 logic elements, approximately 53.25 Mbits of on-chip RAM, and 696 I/Os makes it well suited for consolidating multi-function designs into a single programmable device.

Engineers and procurement teams looking for a commercial-grade, RoHS-compliant FPGA in a high-pin-count BGA package will find this device appropriate for demanding programmable logic applications where on-chip resources and I/O density drive system architecture decisions.

Request a quote or submit an inquiry for pricing and availability for the 5SGXEABK1H40C2LN to evaluate its fit for your next high-density FPGA design.