5SGXEABK1H40I2N

The 5SGXEABK1H40I2N is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in an industrial temperature grade. It delivers high logic density and substantial on‑chip memory capacity in a 1517‑BBGA FCBGA package suited for surface‑mount assembly.

With a large I/O count and series-level transceiver capability documented for Stratix V GX devices, this device targets designs that require significant programmable logic, embedded memory, and robust I/O connectivity while operating across industrial temperature ranges.

Key Features

• Core Logic  Approximately 952,000 logic elements, providing extensive programmable logic resources for complex designs.
• Embedded Memory  Approximately 53.248 Mbits of on‑chip RAM to support large buffering, FIFO, and on‑chip data storage requirements.
• I/O Capacity  696 I/O pins to accommodate dense external connectivity and multi‑interface systems.
• Transceiver Capability (Series)  Stratix V GX family documentation lists GX transceiver channel options (series-level) for high‑speed serial links.
• Package and Mounting  1517‑BBGA (FCBGA) package; supplier device package noted as 1517‑HBGA (45×45). Designed for surface mount assembly.
• Power  Core voltage supply range: 870 mV to 930 mV.
• Industrial Grade Operation  Rated operating temperature range: −40 °C to 100 °C.
• Standards Compliance  RoHS compliant.

Typical Applications

• High‑density digital processing  Leverage the large logic element count and embedded RAM for complex signal processing, protocol handling, and custom datapaths.
• Telecommunications and networking  Use the Stratix V GX family transceiver capability and high I/O count for line cards, switches, and packet processing functions.
• Data‑center acceleration  Deploy as a programmable accelerator where extensive logic and memory resources are required for compute offload and data manipulation.
• Industrial control and instrumentation  Industrial temperature rating and plentiful I/O make the device suitable for demanding control, measurement, and automation systems.

Unique Advantages

• High logic integration: The large population of logic elements enables consolidation of multiple functions into a single FPGA, reducing board-level complexity.
• Substantial on‑chip memory: Approximately 53.248 Mbits of embedded RAM supports large buffers and on‑chip data storage, minimizing external memory dependence.
• Extensive I/O fabric: 696 I/O pins provide flexible connectivity options for multi‑protocol interfaces and parallel or serial peripherals.
• Industrial temperature range: Qualified for −40 °C to 100 °C operation to meet requirements of thermally demanding environments.
• Compact FCBGA package: 1517‑BBGA (1517‑HBGA supplier package) balances high pin count with a compact footprint for dense system designs.
• Low‑voltage core operation: Core supply range of 870–930 mV supports designs optimized for power efficiency at the core level.

Why Choose 5SGXEABK1H40I2N?

The 5SGXEABK1H40I2N combines high logic capacity, significant embedded memory, and wide I/O resources in an industrial‑grade Stratix V GX FPGA package. It is well suited for engineers and system designers who need a programmable platform capable of integrating large, complex functions while operating across extended temperature ranges.

As part of the Stratix V GX family, the device aligns with designs that demand scalability, robust on‑chip resources, and the documented series capabilities for high‑speed serial links, offering a solid foundation for advanced networking, acceleration, and industrial applications.

Request a quote or submit an inquiry to begin the procurement process for 5SGXEABK1H40I2N and evaluate how this Stratix V GX FPGA fits your next high‑density design.