5SGXEABK2H40C2L

The 5SGXEABK2H40C2L is a Stratix V GX field-programmable gate array (FPGA) in a 1517-BBGA FCBGA package, engineered for designs that require very large programmable logic capacity and extensive on-chip memory. With 952,000 logic elements, approximately 53.25 Mbits of embedded RAM and 696 user I/Os, this commercial-grade device suits dense, memory-rich FPGA implementations targeting commercial temperature applications.

Designed for surface-mount applications, the device operates from a core voltage range of 820 mV to 880 mV and is specified for 0 °C to 85 °C operation. The part is RoHS compliant.

Key Features

• Core Logic Capacity  952,000 logic elements provide a very large programmable fabric for complex digital designs.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support memory-intensive functions and reduce external memory requirements.
• I/O Connectivity  696 user I/Os to support wide parallel interfaces, high pin-count peripherals, and extensive board-level routing.
• Package and Mounting  1517-BBGA FCBGA (supplier package: 1517-HBGA, 45×45) in a surface-mount form factor for compact system integration.
• Power and Voltage  Core supply range of 820 mV to 880 mV to match low-voltage FPGA power domains.
• Temperature and Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High-density signal processing  Large logic fabric and extensive on-chip RAM support complex DSP, packet processing, and algorithm acceleration implementations.
• Memory-intensive designs  The substantial embedded memory reduces dependence on external RAM for buffering and state storage.
• Multi-interface systems  High I/O count enables integration of multiple parallel interfaces, sensors, and peripheral buses in a single device.
• Commercial electronics  Suited for commercial-temperature products and systems requiring RoHS-compliant components and surface-mount packaging.

Unique Advantages

• Very large programmable fabric: 952,000 logic elements enable implementation of complex, high-gate-count designs without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM helps minimize external memory BOM and simplifies board layout.
• Extensive I/O resources: 696 user I/Os support dense peripheral integration and flexible routing for multi-interface systems.
• Compact, surface-mount package: 1517-BBGA FCBGA (45×45) provides a high-density package footprint suitable for space-constrained boards.
• Low-voltage core compatibility: 820–880 mV supply range aligns with modern low-voltage FPGA power domains to support efficient power delivery.
• Commercial temperature and RoHS compliance: Designed for commercial-temperature deployments and environmentally compliant manufacturing.

Why Choose 5SGXEABK2H40C2L?

The 5SGXEABK2H40C2L offers a combination of very high logic capacity, abundant embedded memory and a large I/O complement in a compact FCBGA package. Its electrical and thermal specifications are targeted to commercial-temperature designs that require dense, memory-rich FPGA implementations while maintaining RoHS compliance.

This part is well suited for teams building complex digital systems that benefit from a single-device solution to reduce board-level complexity and external component count, while supporting high pin-count interfacing and substantial on-chip storage.

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