5SGXEABK2H40C3G

The 5SGXEABK2H40C3G is a high-density Stratix® V GX field‑programmable gate array (FPGA) from Intel, offering substantial on‑chip logic and embedded memory in a 1517‑BBGA (FCBGA) package. This commercial‑grade device is designed for designs that require large programmable logic capacity, significant embedded RAM, and a high I/O count.

Electrical and switching characteristics for the Stratix V family, including transceiver and core/periphery performance, are documented in the Intel Stratix V device datasheet. The part is RoHS compliant and targets applications operating within a 0 °C to 85 °C commercial temperature range.

Key Features

• Logic Capacity  Approximately 952,000 logic elements, enabling large-scale integration of digital functions on a single device.
• Embedded Memory  Approximately 53 Mbits of on‑chip RAM for buffering, look‑up tables, and state storage.
• I/O Density  Up to 696 user I/O pins to support wide parallel interfaces and board‑level connectivity.
• Package & Mounting  1517‑BBGA FCBGA package (supplier device package: 1517‑HBGA, 45×45) with surface‑mount mounting type for compact board integration.
• Power Supply  Core voltage supply range specified at 820 mV to 880 mV for device operation.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, suited to commercial industrial environments.
• Compliance  RoHS compliant to support regulatory requirements for lead‑free assembly.

Typical Applications

• High‑density digital systems  Implement complex custom logic, signal processing, or control algorithms where large logic arrays and embedded RAM are required.
• Prototyping and development platforms  Use as a scalable hardware platform for validating high‑capacity FPGA designs before production.
• Board‑level integration with high I/O  Ideal for systems that need hundreds of user I/Os for parallel interfaces, FPGA‑to‑FPGA links, or peripheral connectivity.

Unique Advantages

• High logic density: Large logic element count provides extensive room for integrating complex functions and state machines on a single device.
• Substantial on‑chip memory: Approximately 53 Mbits of embedded RAM reduces reliance on external memory for buffering and local storage.
• Extensive I/O resources: 696 I/O pins enable broad system interfacing and flexible board partitioning.
• Compact package: 1517‑BBGA (45×45 supplier package) delivers high pin count in a space‑efficient surface‑mount footprint.
• Documented electrical characteristics: Stratix V device datasheet provides detailed electrical and switching specifications to support design and validation.
• Standards‑aligned manufacturing: RoHS compliance supports lead‑free manufacturing and regulatory requirements.

Why Choose 5SGXEABK2H40C3G?

The 5SGXEABK2H40C3G combines a very high logic element count with large embedded memory and a dense I/O complement inside a compact FCBGA package, making it suitable for designs that demand significant on‑chip resources and board‑level integration. Its specified core voltage range and commercial temperature rating align it to commercial electronic systems where performance and integration density are primary considerations.

Engineers and procurement teams selecting this device benefit from the Stratix V family documentation for electrical and switching characteristics, RoHS compliance for manufacturing, and the device’s capacity to consolidate complex digital functions onto a single FPGA.

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