5SGXEABK2H40I2G

The 5SGXEABK2H40I2G is an Intel Stratix® V GX field programmable gate array (FPGA) in a 1517-BBGA (FCBGA) package intended for industrial-temperature applications. It delivers very-high logic density with extensive embedded memory and a large I/O count for complex, high-integration digital designs.

Key hardware characteristics include 952,000 logic elements, approximately 53 Mbits of embedded memory, and up to 696 I/O pins. The device operates over a 0.870–0.930 V core supply range and an industrial operating temperature window of −40 °C to 100 °C.

Key Features

• High-density logic  952,000 logic elements for large-scale digital integration and complex logic functions.
• Embedded memory  Approximately 53 Mbits of on-chip RAM to support buffering, DSP blocks, and state storage.
• Extensive I/O  Up to 696 I/O pins suitable for wide parallel interfaces and numerous peripheral connections.
• Power and voltage  Core supply voltage range of 870 mV to 930 mV to match Stratix V core requirements.
• Package and mounting  1517-BBGA (FCBGA) / supplier package 1517-HBGA (45×45 mm) designed for surface-mount PCB assembly.
• Industrial temperature grade  Rated for operation from −40 °C to 100 °C for deployment in thermally demanding environments.
• Standards and compliance  RoHS-compliant construction.
• Series-level documentation  Device electrical and switching characteristics, including transceiver and I/O timing guidance, are documented in the Stratix V device datasheet.

Typical Applications

• High-density logic designs  Implement large-scale state machines, control logic, and custom compute pipelines using 952,000 logic elements.
• Memory-intensive functions  On-chip embedded memory (≈53 Mbits) supports buffering, packet processing, and DSP data storage.
• High I/O count systems  Use the device’s up to 696 I/Os for wide bus interfaces, parallel sensors, or numerous peripheral connections.
• Industrial equipment  Designed for systems requiring an industrial temperature range (−40 °C to 100 °C) and robust board-level integration.

Unique Advantages

• Massive logic capacity: 952,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing BOM and board complexity.
• Significant on-chip RAM: Approximately 53 Mbits of embedded memory minimizes external memory dependency and improves data throughput.
• Large I/O resources: 696 I/Os provide flexibility for complex interfacing and system expansion without immediate need for external I/O expanders.
• Industrial-grade operation: −40 °C to 100 °C operating range supports deployment in harsher thermal environments.
• Compact BGA footprint: 1517-BBGA package (45×45 mm supplier package) balances high pin count with a PCB-friendly surface-mount form factor.
• Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing and procurement requirements.

Why Choose 5SGXEABK2H40I2G?

The 5SGXEABK2H40I2G combines very-high logic density with substantial embedded memory and a large I/O complement in an industrial-temperature, surface-mount BGA package. These attributes make it suitable for designs that require consolidation of complex logic, significant on-chip buffering, and extensive interfacing while operating across a wide temperature range.

As a member of the Stratix V GX family, the device is supported by the series-level electrical and switching documentation that details transceiver characteristics, core and periphery performance, and I/O timing—helping system designers evaluate integration and performance during development.

Request a quote or submit an inquiry to receive pricing, availability, and technical ordering information for the 5SGXEABK2H40I2G.