5SGXEABK2H40I2N

The 5SGXEABK2H40I2N is an Intel Stratix® V GX-series Field Programmable Gate Array supplied in a 1517-BBGA (FCBGA) package. It delivers very high logic capacity and on-chip memory in an industrial-grade device with a broad operating temperature range.

Designed for applications requiring dense programmable logic, large embedded RAM, and extensive I/O, this device provides a combination of high logic element count, substantial embedded memory, and support for Stratix V GX transceiver speed grades.

Key Features

• Logic Capacity  Approximately 952,000 logic elements for implementing large, complex FPGA designs.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM (53,248,000 bits) to support large buffers, FIFOs, and state storage.
• I/O Density  696 general-purpose I/O pins to interface with multiple peripherals, buses, and high-pin-count systems.
• Transceiver Capability (Series-Level)  Stratix V GX devices include transceiver speed grades with GX channels up to 14.1 Gbps (series specification).
• Power and Core Voltage  Core supply range specified at 870 mV to 930 mV for the device core.
• Package and Mounting  1517-BBGA (FCBGA) package; supplier device package listed as 1517-HBGA (45 × 45) for surface-mount assembly.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C, suitable for industrial-environment deployments.
• Compliance  RoHS-compliant to meet standard environmental requirements.

Typical Applications

• High-speed serial communications  Leverage Stratix V GX transceiver speed grades to implement high-bandwidth serial links and network-interface designs.
• Compute and acceleration  Use the large logic element count and substantial on-chip memory to implement custom accelerators, packet processing, and complex algorithms.
• Industrial control and instrumentation  Industrial temperature rating (–40 °C to 100 °C) and extensive I/O make the device suitable for robust industrial systems and instrumentation.

Unique Advantages

• High logic density: The device’s ~952k logic elements enable integration of large, system-level functions on a single FPGA, reducing external component count.
• Large on-chip memory: Approximately 53.25 Mbits of embedded RAM supports memory-intensive designs and reduces dependence on external memory.
• Extensive connectivity: 696 I/Os provide flexibility for multi-interface designs and high-pin-count integration.
• Industrial robustness: Rated for –40 °C to 100 °C operation, supporting deployment in demanding environments.
• Compact, production-ready package: 1517-BBGA (1517-HBGA supplier package, 45 × 45) surface-mount package suitable for board-level integration.
• Standards-aligned environmental compliance: RoHS-compliant for global manufacturing and regulatory alignment.

Why Choose 5SGXEABK2H40I2N?

The 5SGXEABK2H40I2N positions itself as a high-density, industrial-grade Stratix V GX FPGA suited to designs that require substantial logic resources, large embedded memory, and broad I/O. Its package and power specifications make it appropriate for system-level integration where board space and performance density are priorities.

This device is well matched to engineering teams building complex communications, compute-acceleration, or industrial control systems that benefit from the Scalability and configurability of a Stratix V GX device family and the vendor’s documented device specifications and speed-grade options.

Request a quote or submit an inquiry for pricing and availability to evaluate the 5SGXEABK2H40I2N for your next design.