5SGXEABK2H40I3L

The 5SGXEABK2H40I3L is a Stratix® V GX field programmable gate array (FPGA) in a 1517-ball FCBGA package, offered in an industrial temperature grade. It provides a high-density programmable logic fabric with substantial on-chip RAM and a large I/O count for complex, resource-intensive designs.

This device targets industrial and embedded designs that require large logic capacity, abundant I/O, and on-chip memory while operating across an extended temperature range. The combination of 952,000 logic elements, approximately 53.25 Mbits of embedded memory, and 696 I/O pins supports highly integrated custom hardware implementations.

Key Features

• Core Architecture  Part of the Stratix V GX FPGA family, delivered in an industrial temperature grade suitable for extended-temperature applications.
• Logic Capacity  952,000 logic elements (logic cells) providing high-density programmable logic resources for large designs.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support buffering, data storage, and on-chip processing without external memory dependence.
• I/O Resources  696 user I/O pins for extensive peripheral interfacing and system integration.
• Power and Voltage  Core supply range specified at 0.820 V to 0.880 V to match system power-rail requirements and power-management strategies.
• Package & Mounting  1517-BBGA (FCBGA) surface-mount package; supplier device package listed as 1517-HBGA (45 × 45 mm) for PCB footprint planning.
• Thermal Range  Industrial operating temperature range from −40 °C to 100 °C for reliable operation in demanding environments.
• Environmental Compliance  RoHS compliant to support lead-free assembly and regulatory expectations.

Typical Applications

• Industrial Control & Automation  Large logic capacity and wide operating temperature range enable complex control algorithms and real-time processing in industrial environments.
• High‑Density Embedded Systems  Extensive on-chip RAM and abundant I/O support integration of custom accelerators, data buffering, and multiple peripheral interfaces on a single device.
• Communications & Infrastructure  High I/O count and large programmable fabric make the device suitable for implementing custom protocol processing and system-level data handling in infrastructure equipment.

Unique Advantages

• Very high logic density: 952,000 logic elements enable consolidation of complex functions into a single FPGA, reducing board-level complexity.
• Large embedded memory: Approximately 53.25 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O capacity: 696 I/O pins allow integration of numerous peripherals, interfaces, and parallel data paths without external I/O expanders.
• Industrial temperature operation: Rated from −40 °C to 100 °C for applications that require extended-temperature robustness.
• Compact high-ball-count package: 1517-BBGA (FCBGA) in a 45 × 45 mm supplier package supports dense PCB layouts while maintaining surface-mount assembly compatibility.
• Compliance-ready: RoHS compliance simplifies regulatory and manufacturing considerations for lead-free assembly.

Why Choose 5SGXEABK2H40I3L?

The 5SGXEABK2H40I3L combines substantial programmable logic capacity, significant on-chip RAM, and a large I/O complement in an industrial-grade Stratix V GX FPGA package. It is suited to designers who need to integrate large, high-performance hardware functions and extensive peripheral connectivity within a single FPGA while maintaining operation across an extended temperature range.

For teams building complex embedded systems, industrial controllers, or communications infrastructure, this device offers a high level of integration that can reduce system BOM and board space while maintaining design flexibility through programmable logic.

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