5SGXEABK3H40C2G

The 5SGXEABK3H40C2G is a Stratix® V GX family Field Programmable Gate Array (FPGA) IC from Intel. It delivers very-high logic capacity and on-chip embedded memory in a high-pin-count FCBGA package for demanding, programmable-logic applications.

Built for commercial temperature systems, this device combines large logic resources, substantial embedded RAM, and abundant I/O to support complex custom logic, data buffering, and high-density interfacing while operating within a low core voltage range.

Key Features

• Core logic capacity — 952,000 logic elements to implement large-scale custom logic, state machines, and datapath functions.
• Embedded memory — Approximately 53.248 Mbits of on-chip RAM for frame buffering, FIFOs, and local data storage.
• I/O density — 696 I/O pins to support extensive external connectivity and parallel interfaces.
• Power and core supply — Operates from a core supply range of 870 mV to 930 mV, enabling compatibility with low-voltage system designs.
• Package & mounting — 1517-BBGA (FCBGA) package; supplier device package listed as 1517-HBGA (45×45) for compact, high-pin-count board integration. Surface-mount mounting type.
• Commercial temperature grade — Rated for 0 °C to 85 °C operation for use in commercial environments.
• Standards compliance — RoHS compliant for lead-free manufacturing and regulatory alignment.
• Stratix V GX family capabilities — As described in the Stratix V GX device documentation, the family supports GX transceiver channel options in the datasheet (family-level transceiver performance and I/O timing are documented in the device datasheet).

Typical Applications

• High-density custom logic — Large logic capacity and abundant I/O for complex state machines, protocol offload, and custom silicon replacement.
• Data buffering and on-chip storage — Approximately 53.25 Mbits of embedded RAM supports FIFOs, packet buffering, and temporary data storage close to logic.
• High-pin-count system integration — 696 I/Os and a 1517-BBGA package enable dense external interfacing for multi-channel or multi-board systems.

Unique Advantages

• High logic density: 952,000 logic elements provide headroom for large designs and consolidation of multiple functions into a single device.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O count: 696 I/Os allow flexible, high-parallelism interfacing to peripherals, memory, and other FPGAs or ASICs.
• Compact, high-pin package: 1517-BBGA (FCBGA) with supplier package 1517-HBGA (45×45) supports compact board designs while preserving high-pin accessibility.
• Commercial temperature rating: Specified 0 °C to 85 °C operation for deployment in commercial-grade systems.
• Regulatory readiness: RoHS compliance supports lead-free manufacturing processes and regulatory requirements.

Why Choose 5SGXEABK3H40C2G?

The 5SGXEABK3H40C2G targets designers who need a high-density, commercial-grade Stratix V GX FPGA with large logic and memory resources and extensive I/O. Its combination of 952,000 logic elements, roughly 53.25 Mbits of embedded RAM, and 696 I/Os in a 1517-BBGA package provides a platform for consolidating complex functions, implementing deep buffering, and supporting wide external connectivity while operating within a low core-voltage envelope.

For teams building large-scale programmable designs that require on-chip memory and high-pin-count interfaces in commercial temperature environments, this device provides a scalable, RoHS-compliant option documented in the Stratix V device datasheet.

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