5SGXEABK3H40C2LN

The 5SGXEABK3H40C2LN is a Stratix® V GX Field Programmable Gate Array (FPGA) provided in a 1517-BBGA FCBGA package. It delivers very large logic capacity and on-chip memory for complex digital designs where high integration and large-scale logic fabric are required.

This commercial-grade device includes high-density I/O and Stratix V GX transceiver capability defined by the Stratix V series datasheet, making it suitable for designs that require extensive logic, embedded RAM, and high-speed serial interfaces within a surface-mount 45×45 mm package.

Key Features

• Logic Capacity  952,000 logic elements for large-scale logic integration and complex design implementations.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support data buffering, large FIFOs, and memory-intensive functions.
• I/O Density  696 user I/O pins to accommodate multi-channel interfaces, parallel buses, and extensive peripheral connectivity.
• High-speed Transceivers (Series Capability)  Stratix V GX transceiver capability per the Stratix V series datasheet (transceiver speed grades up to 14.1 Gbps are defined for the GX series).
• Package and Mounting  1517-BBGA (FCBGA) package; supplier device package specified as 1517-HBGA (45×45). Surface-mount mounting type supports modern PCB assembly.
• Power  Core supply voltage range specified at 820 mV to 880 mV for the device core domain.
• Operating Temperature and Grade  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-density logic systems  Use the large logic element count and embedded RAM for complex control, processing, and algorithm acceleration tasks.
• I/O-intensive interfaces  Leverage 696 I/Os for multi-port connectivity, sensor aggregation, and parallel data paths.
• High-speed serial designs  Deploy Stratix V GX transceiver capability (as described in the series datasheet) for designs requiring high-speed serial links.

Unique Advantages

• Massive logic integration: 952,000 logic elements reduce the need for multiple devices and simplify partitioning of large designs.
• Substantial on-chip RAM: Approximately 53.25 Mbits of embedded memory supports large buffers and on-chip data storage without external memory dependency.
• High I/O count: 696 I/Os enable dense front-end interfaces and extensive peripheral connectivity in a single FPGA.
• Surface-mount, high-density package: 1517-BBGA (45×45) package provides a compact form factor suitable for high-density PCB layouts.
• Defined core voltage window: Core supply specified between 820 mV and 880 mV for precise power budgeting and supply design.
• Commercial grade with RoHS compliance: Rated for 0 °C to 85 °C operation and compliant with RoHS requirements for regulatory alignment.

Why Choose 5SGXEABK3H40C2LN?

The 5SGXEABK3H40C2LN positions itself as a high-capacity Stratix V GX FPGA option for designs that demand extensive logic resources, significant on-chip memory, and a high count of user I/Os in a single surface-mount package. Its defined core voltage range and commercial operating temperature make it suitable for production-grade digital and high-speed designs where the Stratix V series' transceiver capabilities are relevant.

This device is a fit for engineering teams targeting large logic integration, complex data buffering, and dense I/O requirements while maintaining a compact board footprint and RoHS compliance. Designers can leverage the device’s capacity and package attributes for scalable, single-FPGA implementations driven by the Stratix V GX family specifications.

Request a quote or submit an inquiry to receive pricing and availability information for the 5SGXEABK3H40C2LN FPGA and to discuss how it can meet your design requirements.