5SGXEABK3H40C3N

The 5SGXEABK3H40C3N is a Stratix® V GX field programmable gate array (FPGA) offered in a 1517‑BBGA FCBGA package for surface‑mount assembly. The device provides large on‑chip resources, including 952,000 logic elements and approximately 53.25 Mbits of embedded memory, and exposes 696 general-purpose I/O pins for dense system integration.

Designed for commercial‑grade applications, this Stratix V GX device operates with a core supply range of 820 mV to 880 mV and a commercial operating temperature range of 0 °C to 85 °C. The device is RoHS‑compliant and packaged in a 1517‑HBGA (45 × 45 mm) supplier package.

Key Features

• Core Logic Capacity  952,000 logic elements provide a large programmable fabric for complex logic, custom compute pipelines, and integration of multiple functions on a single device.
• Embedded Memory  Approximately 53.25 Mbits of on‑chip RAM suitable for buffering, shared memory, and data path storage.
• I/O Density  696 I/O pins enable extensive external device interfacing and high‑pin‑count system connectivity.
• Power Supply  Core voltage supply range of 820 mV to 880 mV for the device core as specified.
• Package & Mounting  1517‑BBGA FCBGA package, supplier device package 1517‑HBGA (45 × 45 mm), optimized for surface‑mount PCB assembly.
• Temperature & Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
• Standards Compliance  RoHS‑compliant for environmental and manufacturing conformance.
• Stratix V GX Series Characteristics  Device belongs to the Stratix V GX family; the device family datasheet documents electrical, switching, and transceiver characteristics for Stratix V GX devices.

Typical Applications

• High‑density compute and acceleration  Leverage 952,000 logic elements and ~53.25 Mbits of embedded memory for custom compute pipelines, dataflow acceleration, and algorithm offload.
• Network and connectivity systems  High I/O count (696 pins) supports complex board‑level interfaces and dense protocol implementations; suitable where large I/O and on‑chip logic are required.
• Signal processing and protocol engines  Large logic and memory resources allow implementation of multi‑channel signal processing, packet processing, and protocol conversion functions within a single device.

Unique Advantages

• Substantial on‑chip resources: 952,000 logic elements and approximately 53.25 Mbits of embedded RAM reduce the need for external logic or memory components.
• High pin count for system integration: 696 I/O pins enable dense connectivity to peripherals, high‑speed interfaces, and multi‑channel designs.
• Manufacturing‑friendly package: 1517‑BBGA FCBGA (supplier package 1517‑HBGA, 45 × 45 mm) supports surface‑mount assembly for compact, high‑density PCB layouts.
• Commercial‑grade operating range: Rated for 0 °C to 85 °C, suitable for a wide range of commercial electronic systems.
• Regulatory compliance: RoHS‑compliant to meet environmental requirements for modern manufacturing processes.

Why Choose 5SGXEABK3H40C3N?

The 5SGXEABK3H40C3N delivers extensive programmable logic and on‑chip memory in a single Stratix V GX FPGA, making it well suited for designs that require large logic capacity, significant embedded RAM, and a high number of I/Os. Its commercial temperature rating and surface‑mount 1517‑BBGA package support compact, manufacturable system implementations.

This device is a practical choice for engineering teams targeting complex FPGA-based designs that need to consolidate functions, minimize external components, and leverage the Stratix V GX family’s documented electrical and switching characteristics.

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