5SGXEABK3H40C3G

IC FPGA 696 I/O 1517HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 53248000 952000 1517-BBGA, FCBGA

Quantity 956 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-HBGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs359200Number of Logic Elements/Cells952000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXEABK3H40C3G – Stratix® V GX FPGA, 952,000 logic elements, 1517‑BBGA

The 5SGXEABK3H40C3G is a Stratix® V GX Field Programmable Gate Array (FPGA) in a 1517‑BBGA FCBGA package, offered in a commercial temperature grade. As a member of the Stratix V GX family, it delivers large logic capacity, abundant embedded memory, and high‑density I/O for complex system designs.

This device addresses applications that require extensive programmable logic, substantial on‑chip RAM, and high I/O counts while operating from a core supply range of 820 mV to 880 mV and a commercial ambient range of 0 °C to 85 °C.

Key Features

  • Logic Resources  Approximately 952,000 logic elements and 359,200 logic blocks provide a very large programmable fabric for complex algorithms, custom accelerators, and wide datapaths.
  • Embedded Memory  Approximately 53.2 Mbits of on‑chip RAM (53,248,000 bits) to support buffering, packet storage, and large lookup tables without external memory.
  • I/O Density  696 user I/Os support dense peripheral connectivity and high‑pin‑count interfaces for system integration.
  • High‑Speed Transceiver Capability (series‑level)  Stratix V GX devices include transceiver speed grades at series level (examples include support for up to 14.1 Gbps channels) for high‑bandwidth serial links and protocol bridging.
  • Package and Mounting  1517‑BBGA (supplier package: 1517‑HBGA, 45×45 mm) FCBGA package; surface mount for compact board integration.
  • Power and Thermal  Core supply range from 820 mV to 880 mV with a commercial operating temperature range of 0 °C to 85 °C to match standard commercial systems.
  • Compliance  RoHS‑compliant material status to meet environmental requirements for commercial electronics.

Typical Applications

  • High‑performance networking  Implements protocol processing, packet parsing, and high‑speed serial aggregation using the device’s high I/O count and series‑level transceiver capabilities.
  • Data center acceleration  Large logic capacity and substantial embedded RAM enable custom compute kernels and inline data processing functions.
  • Telecommunications  Supports complex framing, channelization, and high‑bandwidth serial links where large programmable fabric and on‑chip memory are required.
  • Broadcast and video processing  Handles real‑time video pipelines and multi‑stream processing with plentiful logic elements and RAM for buffering and format conversion.

Unique Advantages

  • High integration density: The combination of ~952k logic elements and ~53.2 Mbits of embedded RAM reduces the need for external components and simplifies board design.
  • Large I/O footprint: 696 I/Os provide flexibility to connect wide parallel buses, multiple high‑speed interfaces, and numerous peripherals directly to the FPGA.
  • Series‑level transceiver support: Stratix V GX family transceiver grades enable implementation of high‑bandwidth serial links for networking and telecom applications.
  • Commercial temperature suitability: Specified for 0 °C to 85 °C commercial operation to match mainstream electronic product requirements.
  • Compact FCBGA packaging: 1517‑BBGA (45×45 mm) package delivers high pin count in a compact surface‑mount form factor for dense system boards.
  • RoHS compliance: Environmentally compliant materials simplify regulatory alignment for commercial products.

Why Choose 5SGXEABK3H40C3G?

The 5SGXEABK3H40C3G balances very large programmable logic and embedded memory with high I/O density and series‑level transceiver capability in a compact 1517‑BBGA package. It is positioned for commercial systems that demand substantial on‑chip resources for protocol processing, data acceleration, and complex signal processing.

Engineers building high‑bandwidth networking, telecom, or compute‑optimized solutions will find the device’s logic capacity, RAM, and I/O count well suited to consolidating functions into a single FPGA fabric, enabling tighter integration and simplified system architectures. Device documentation for the Stratix V family provides the electrical and switching characteristics necessary for design and validation.

Request a quote or submit an inquiry to purchase the 5SGXEABK3H40C3G and discuss availability, pricing, and lead time for your design requirements.

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