5SGXEABK3H40C2N

The Intel 5SGXEABK3H40C2N is a Stratix V GX field-programmable gate array (FPGA) packaged in a 1517-ball BGA (FCBGA) with a 45 × 45 mm supplier package footprint. It provides large on-chip logic and memory resources along with a high I/O count to support complex, high-density designs.

This device targets designs that require extensive programmable logic, substantial embedded RAM, and broad external connectivity while operating within a commercial temperature grade and a defined low-voltage core supply range.

Key Features

• Core Logic  Approximately 952,000 logic elements (cells) for implementing large-scale programmable logic and complex combinational/sequential functions.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support buffering, lookup tables, and memory-intensive logic functions.
• I/O Count  696 device I/O pins, enabling extensive peripheral and board-level connectivity.
• Package & Mounting  1517-BBGA (FCBGA) package; supplier device package listed as 1517-HBGA (45×45). Surface-mount mounting type for standard PCB assembly flows.
• Power Supply  Core voltage supply range of 870 mV to 930 mV, specifying the operating window for the device core.
• Operating Temperature  Commercial grade operation from 0°C to 85°C for typical commercial-environment deployments.
• Compliance  RoHS compliant, aligning with common environmental requirements for electronic components.

Typical Applications

• High-density digital systems  Used where large programmable logic capacity and embedded memory are required to consolidate multiple functions onto a single device.
• Data buffering and custom memory logic  Leverages approximately 53.25 Mbits of on-chip RAM for packet buffering, FIFOs, and other memory-intensive blocks.
• Multi-interface designs  Supports systems that need a high number of I/O signals for interfacing with peripherals, mezzanine cards, or board-level connectors.

Unique Advantages

• Substantial logic capacity: 952,000 logic elements enable implementation of large, complex designs without partitioning across multiple devices.
• Significant on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs.
• High I/O density: 696 I/O pins provide flexibility for broad system interfacing and parallel signal routing.
• Compact BGA packaging: 1517-BBGA (45×45 supplier footprint) offers a high-density board-level solution compatible with surface-mount assembly.
• Defined operating envelope: Commercial temperature range (0°C to 85°C) and a specified core supply range (870 mV–930 mV) make power and thermal planning straightforward.
• RoHS compliant: Meets common environmental material requirements for commercial electronic products.

Why Choose 5SGXEABK3H40C2N?

The 5SGXEABK3H40C2N provides a combination of very large programmable logic capacity, substantial embedded RAM, and a high I/O count in a single Stratix V GX FCBGA package. These characteristics make it well suited for designers who need to consolidate complex digital functions and substantial on-chip memory in a commercial-temperature FPGA solution.

As a member of the Stratix V family from Intel, this device is documented with device-level electrical and switching characteristics to support system integration, power planning, and package selection. It is appropriate for development flows and production use within the stated commercial operating conditions.

Request a quote or submit an inquiry for the 5SGXEABK3H40C2N to receive pricing and availability information for your design requirements.