5SGXEABK3H40I3L

IC FPGA 696 I/O 1517HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 53248000 952000 1517-BBGA, FCBGA

Quantity 1,400 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-HBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs359200Number of Logic Elements/Cells952000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXEABK3H40I3L – Stratix® V GX FPGA, 952,000 logic elements, 1517-BBGA FCBGA

The 5SGXEABK3H40I3L is an Intel Stratix V GX field-programmable gate array (FPGA) supplied in a 1517-BBGA FCBGA package (supplier device package: 1517-HBGA, 45×45). This industrial-grade, surface-mount FPGA integrates high logic density, substantial embedded memory, and broad I/O to support complex, high-performance digital designs.

With 952,000 logic elements, approximately 53.25 Mbits of on-chip RAM and 696 I/O pins, the device is targeted at designs that require large programmable fabric, extensive memory resources, and high I/O counts. The Stratix V GX series also includes high-speed transceiver speed grades (up to 14.1 Gbps in the family), enabling high-bandwidth serial connectivity where required.

Key Features

  • Core & logic density  952,000 logic elements and 359,200 CLBs provide a very large programmable fabric for implementating complex logic, datapaths, and custom accelerators.
  • Embedded memory  Approximately 53.25 Mbits of on-chip RAM for buffering, FIFOs, and on-chip data storage to support memory-hungry designs.
  • I/O and connectivity  696 general-purpose I/Os enable extensive peripheral interfacing and high pin-count system integration; Stratix V GX family transceiver speed grades support high-speed serial channels (family-level rates up to 14.1 Gbps).
  • Power  Core supply operating range specified at 820 mV to 880 mV, enabling designers to plan power delivery and thermal budgets precisely.
  • Package  1517-BBGA FCBGA package (supplier device package: 1517-HBGA, 45×45) for compact, high-pin-count board integration.
  • Operating environment  Industrial-grade operating temperature range from −40 °C to 100 °C for deployment in demanding thermal environments.
  • RoHS compliant  Device meets RoHS requirements for environmental compliance.

Typical Applications

  • High-performance networking  Use the high logic density, large embedded memory, and family transceiver capabilities to implement packet processing, switching, and protocol acceleration.
  • High-speed serial connectivity  Stratix V GX family transceiver speed grades support designs that require multi-gigabit serial links alongside extensive parallel I/O.
  • Data processing and acceleration  Large logic and memory resources enable custom datapaths, hardware accelerators, and real-time processing engines.
  • Complex system integration  High I/O count and compact FCBGA package facilitate integration of the FPGA into dense, multi-board systems and advanced mezzanine modules.

Unique Advantages

  • Very high logic capacity: 952,000 logic elements and 359,200 CLBs allow implementation of highly parallel, large-scale logic designs on a single device.
  • Substantial on-chip RAM: Approximately 53.25 Mbits of embedded memory reduces dependence on external memory for many buffering and caching tasks.
  • Extensive I/O enablement: 696 I/O pins provide flexibility for interfacing with multiple peripherals, sensors, and high-pin-count connectors.
  • Industrial temperature range: Rated from −40 °C to 100 °C to support deployments in thermally challenging and industrial environments.
  • Precise power specification: Core voltage range of 820 mV to 880 mV helps planners size power delivery networks and estimate dissipation.
  • RoHS compliance: Supports environmental and regulatory requirements for lead-free manufacturing.

Why Choose 5SGXEABK3H40I3L?

The 5SGXEABK3H40I3L combines very large programmable fabric, significant on-chip memory, and a high I/O count in a compact 1517-BBGA FCBGA package, making it suitable for demanding, high-density FPGA implementations. Its industrial temperature rating and defined core-voltage range allow system designers to plan for robust operation and predictable power delivery.

This part is well suited for engineering teams developing high-performance networking, data-processing, and complex system-integration projects that need a scalable Stratix V GX solution with extensive resources and clear electrical and thermal parameters.

Request a quote or submit a product inquiry to receive pricing, availability, and technical support information for 5SGXEABK3H40I3L.

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