5SGXEABK3H40I3LN

The 5SGXEABK3H40I3LN is a Stratix® V GX field programmable gate array (FPGA) in a 1517-BBGA (FCBGA) package intended for industrial-grade deployments. It provides very large logic capacity, substantial on-chip memory, and a high I/O count for dense, feature-rich designs.

Designed for applications that require significant integration and configurability, this device combines a low-voltage core operating range with wide operating temperature support to address demanding embedded and industrial system requirements.

Key Features

• Logic Capacity  Approximately 952,000 logic elements enabling complex logic implementations and high-density designs.
• Configurable Logic Blocks  Specified with 359,200 logic blocks providing granular resource distribution across the device.
• Embedded Memory  Approximately 53 Mbits of on-chip RAM for large buffering, frame storage, and embedded data structures.
• I/O Density  696 user I/Os to support wide parallel interfaces, multi-channel sensor arrays, or extensive peripheral connectivity.
• Power and Core Voltage  Core supply range of 820 mV to 880 mV for the device core voltage domain.
• Package & Mounting  1517-BBGA (FCBGA) package, supplier package 1517-HBGA (45×45), optimized for surface-mount assembly.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
• Regulatory  RoHS compliant.

Typical Applications

• High-density signal processing  Use the device's large logic and memory resources to implement complex DSP pipelines and custom data-paths.
• Telecommunications and networking  High I/O count and large on-chip memory support multi-channel packet processing, buffering, and protocol offload.
• Industrial control and automation  Industrial temperature rating and broad I/O allow deployment in factory automation, motor control, and machine-vision systems.
• Embedded system integration  Integrate multiple system functions and peripherals into a single, programmable silicon device to reduce board-level BOM.

Unique Advantages

• High logic integration: Leverage approximately 952,000 logic elements to consolidate complex functions that would otherwise require multiple devices.
• Substantial on-chip memory: Approximately 53 Mbits of embedded RAM reduces external memory needs and improves data throughput.
• Extensive I/O capability: 696 I/Os provide the port density needed for parallel interfaces, multi-lane systems, and broad peripheral connectivity.
• Industrial-ready thermal range: –40 °C to 100 °C operating range suitable for harsh or variable-temperature environments.
• Compact, surface-mount FCBGA package: 1517-BBGA form factor (supplier package 45×45) balances PCB area with thermal and routing considerations.
• Low-voltage core operation: Core supply between 820 mV and 880 mV aligns with modern low-power FPGA designs.

Why Choose 5SGXEABK3H40I3LN?

The 5SGXEABK3H40I3LN positions itself for projects that need very large programmable logic capacity, generous embedded RAM, and dense I/O in an industrial-temperature FPGA. Its combination of logic elements, memory, and I/O enables consolidation of complex subsystems into a single programmable device, simplifying board design and reducing component count.

This device is suited to engineering teams designing high-density embedded systems, communications equipment, and industrial control platforms that require programmable flexibility, robust operating temperature support, and surface-mount packaging in a compact footprint.

Request a quote or submit an inquiry to obtain pricing, lead-time, and availability for the 5SGXEABK3H40I3LN. Our team can provide configuration guidance and support for your design evaluation and procurement process.