5SGXEABK3H40I4N

The 5SGXEABK3H40I4N is a Stratix® V GX FPGA device provided in a 1517-BBGA FCBGA package. It delivers very large programmable logic capacity and embedded memory, packaged for surface-mount board assembly and rated for industrial temperature operation.

With 952,000 logic elements and approximately 53 Mbits of embedded memory, this device targets high-density, high-channel-count designs that require extensive on-chip resources and a wide range of I/O connectivity.

Key Features

• Logic Capacity  952,000 logic elements for large-scale programmable logic and complex design implementation.
• Embedded Memory  Approximately 53 Mbits of total on-chip RAM bits to support large buffering, state storage, and memory-intensive functions.
• I/O Density  696 user I/O pins to support dense board-level interfaces and multi-channel connectivity.
• Transceiver Family Capability  Member of the Stratix V GX family; the series documentation includes transceiver speed-grade information for high-speed channels at the family level.
• Power and Core Voltage  Core voltage supply in the range of 820 mV to 880 mV, enabling design planning for the device’s power domain.
• Package and Mounting  1517-BBGA (FCBGA) package; supplier device package listed as 1517-HBGA (45×45) and intended for surface-mount assembly.
• Industrial Temperature Grade  Rated operating temperature range −40°C to 100°C for deployment in industrial environments.
• Compliance  RoHS compliant.

Typical Applications

• High-density programmable logic  Use the device’s 952,000 logic elements and large embedded RAM to implement complex, large-scale custom logic architectures.
• High I/O and interface consolidation  Leverage 696 I/Os to integrate multiple board-level interfaces and consolidate system connectivity on a single FPGA.
• Industrial-grade systems  The −40°C to 100°C operating range makes this device suitable for industrial applications that require extended temperature tolerance.
• Designs requiring on-chip memory  Approximately 53 Mbits of embedded RAM provides significant on-chip storage for buffering, FIFOs, and state machines.

Unique Advantages

• Very large programmable capacity: 952,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing component count.
• Substantial embedded memory: Approximately 53 Mbits of on-chip RAM supports memory-heavy algorithms and minimizes external memory dependencies.
• Extensive I/O complement: 696 I/Os provide flexibility for high-channel-count designs and dense interface routing.
• Industrial temperature rating: Rated from −40°C to 100°C to accommodate applications deployed in demanding thermal environments.
• Surface-mount, high-density package: 1517-BBGA (1517-HBGA supplier designation, 45×45) enables compact PCB integration for space-constrained systems.
• Regulatory compliance: RoHS compliance supports environmentally conscious product builds.

Why Choose 5SGXEABK3H40I4N?

The 5SGXEABK3H40I4N combines very large logic capacity, significant embedded memory, and a high I/O count in a single industrial-grade, surface-mount package. These characteristics make it well suited to engineers building consolidated, resource-intensive FPGA designs that require substantial on-chip resources and robust thermal tolerance.

As part of the Stratix V GX family, this device aligns with the family-level electrical and transceiver specifications documented for Stratix V devices, allowing designers to reference the series documentation for device-level electrical and switching characteristics during development.

Request a quote or submit an inquiry for pricing and availability to begin integrating the 5SGXEABK3H40I4N into your design workflow.