5SGXEABN1F45C2LG
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 53248000 952000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 946 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 359200 | Number of Logic Elements/Cells | 952000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXEABN1F45C2LG – Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 I/Os, ~53.25 Mbits, 952000 logic elements, 1932-BBGA
The 5SGXEABN1F45C2LG is a Stratix V GX family FPGA in a 1932-ball FCBGA package designed for high-density, high-bandwidth digital designs. It delivers large logic capacity and significant on-chip memory to support complex signal processing, networking, and compute-accelerated applications.
Built for commercial-temperature systems, this surface-mount device combines 952,000 logic elements with approximately 53.25 Mbits of embedded memory and 840 user I/Os, enabling dense integration of logic, state, and interfaces in a single silicon device.
Key Features
- Logic Capacity — 952,000 logic elements to implement large state machines, datapaths, and custom accelerators.
- Embedded Memory — Approximately 53.25 Mbits of on-chip RAM for buffering, FIFOs, and large table storage without external memory.
- I/O Density — 840 general-purpose I/Os to support extensive peripheral and high-pin-count interface requirements.
- Package — 1932-ball BGA (FCBGA) package with supplier package 1932-FBGA, FC (45×45) for high-pin-count board designs and robust solder mounting.
- Power Supply — Core voltage supply range from 820 mV to 880 mV to match platform power rails and power management schemes.
- Mounting & Grade — Surface mount package in a commercial temperature grade (0 °C to 85 °C) for standard commercial electronic systems.
- Compliance — RoHS-compliant manufacturing status.
Typical Applications
- High-performance Networking: Use the large logic and memory resources to implement packet processing, switching logic, and multiple protocol interfaces.
- Signal Processing & Acceleration: Deploy custom DSP pipelines and hardware accelerators that require significant on-chip RAM and logic resources.
- Data Center & Compute Front-ends: Integrate complex control and data-path logic with high I/O counts for board-level aggregation and interface bridging.
Unique Advantages
- Massive Logic Resource: 952,000 logic elements enable consolidation of multi-block functions and reduce the need for multiple devices.
- Substantial On-chip Memory: Approximately 53.25 Mbits of embedded RAM reduces reliance on external memory and accelerates data movement within the FPGA.
- High I/O Count: 840 I/Os provide flexible connectivity for a wide range of peripherals and multi-lane interfaces on a single chip.
- Compact High-Pin Package: 1932-ball FCBGA footprint supports high-density board routing while keeping the BOM compact.
- Commercial Temperature Qualification: Rated for 0 °C to 85 °C operation, suitable for standard commercial deployments and applications.
- RoHS Compliance: Environmentally compliant manufacturing supports global product distribution requirements.
Why Choose 5SGXEABN1F45C2LG?
This Stratix V GX FPGA balances extensive logic and memory resources with a high I/O count in a single commercial-grade FCBGA package, making it well suited for demanding digital designs that require on-chip storage and expansive interfacing. Its core voltage range and package density let system designers align power and mechanical integration with existing platform constraints.
Choose the 5SGXEABN1F45C2LG for designs that need large-scale programmable logic, sizable embedded RAM, and broad I/O capability while maintaining commercial-temperature operation and RoHS compliance.
Request a quote or submit an inquiry to receive pricing and availability for the 5SGXEABN1F45C2LG and to discuss how it can be integrated into your next design.

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