5SGXEABN1F45C2N

The 5SGXEABN1F45C2N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC in a 1932-BBGA (FCBGA) package. It provides a high count of logic resources and on-chip RAM for designs that require large programmable logic capacity and substantial embedded memory.

This commercial-grade FPGA features a broad I/O complement and a low-voltage core supply range, making it suitable for board-level designs needing dense integration and significant interface capacity.

Key Features

• Logic Capacity  952,000 logic elements (logic cells) for large-scale programmable logic implementations.
• Embedded Memory  Approximately 53.25 Mbits of total on-chip RAM (53,248,000 bits) to support buffering, lookup tables, and state storage.
• I/O Resources  840 user I/O pins to accommodate extensive external interfaces and parallel connectivity.
• Power Supply  Core supply range of 870 mV to 930 mV, enabling operation within a defined low-voltage core domain.
• Package & Mounting  1932‑BBGA (FCBGA) package; supplier device package listed as 1932‑FBGA, FC (45×45). Surface mount device for standard PCB assembly.
• Temperature & Grade  Commercial grade device rated for an operating temperature range of 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High-density digital systems  Leverages 952,000 logic elements and substantial on-chip RAM to implement complex state machines, data paths, and algorithm acceleration.
• Interface aggregation  840 I/O pins provide the channel count needed for designs that consolidate multiple external interfaces or parallel buses on a single device.
• Board-level integration  1932-BBGA packaging and surface-mount mounting facilitate compact, high-density PCB layouts where space and pin count are critical.

Unique Advantages

• Large programmable fabric: 952,000 logic elements enable implementation of extensive custom logic without partitioning across multiple devices.
• Significant on-chip RAM: Approximately 53.25 Mbits of embedded memory reduces reliance on external memory for buffering and state storage.
• High I/O count: 840 user I/Os allow direct connection to numerous peripherals and parallel data interfaces, simplifying board design.
• Compact, assembly-ready package: 1932-BBGA (45×45) surface-mount package supports high-density routing and standard manufacturing processes.
• Defined low-voltage core operation: 870 mV–930 mV core supply specification helps integrate with low-voltage power domains on modern PCBs.
• Commercial temperature rating: Specified operation from 0 °C to 85 °C for applications targeting commercial environments.

Why Choose 5SGXEABN1F45C2N?

The 5SGXEABN1F45C2N combines a very high logic element count with large embedded RAM and an extensive I/O complement in a compact BGA package—providing a practical solution for designs that demand substantial on-chip resources without distributing functionality across multiple devices. Its commercial temperature rating and RoHS compliance align it with industry-standard board-level products.

This FPGA is well suited for engineering teams and procurement groups building dense digital systems that require scalable logic capacity, on-chip memory for buffering and lookup functions, and a high number of external connections while maintaining a surface-mount, assembly-friendly footprint.

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