5SGXEABN1F45C2LN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 53248000 952000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 1,394 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 359200 | Number of Logic Elements/Cells | 952000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXEABN1F45C2LN – Stratix V GX Field Programmable Gate Array (FPGA) IC
The 5SGXEABN1F45C2LN is a Stratix V GX family FPGA in a 1932-BBGA FCBGA package, designed for commercial embedded and board-level applications. It offers a large logic fabric and significant on-chip memory, combined with a high I/O count and a compact surface-mount package suitable for dense system designs.
Targeted use cases include complex digital signal processing, high-channel I/O control, and advanced programmable logic implementations where high gate counts and embedded memory capacity are required. The device is RoHS compliant and rated for commercial operation.
Key Features
- High Logic Density — 952,000 logic elements to implement large, complex designs and deep custom logic.
- Significant Embedded Memory — Approximately 53 Mbits of on-chip RAM to support large buffering, FIFOs, and state storage without external memory.
- Extensive I/O — 840 user I/O pins for wide parallel interfaces, high-channel count connectivity, and flexible board-level routing.
- Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial applications.
- Low-Voltage Core — Core supply specified at 820 mV to 880 mV to align with modern low-voltage system architectures.
- Package and Mounting — 1932-BBGA, FCBGA (supplier package: 1932-FBGA, FC 45×45) in a surface-mount form factor for compact board layouts.
- Regulatory Compliance — RoHS compliant for environmental and manufacturing compliance needs.
Typical Applications
- Telecommunications and Networking — Implement high-density packet processing, protocol bridging, and programmable dataplane functions using the device's large logic and memory resources.
- High-Performance Embedded Systems — Use for custom accelerators, DSP pipelines, and control logic where on-chip RAM and abundant logic elements reduce external components.
- Industrial Control and Instrumentation — Support complex control algorithms and multi-channel I/O aggregation within the commercial temperature range.
- Test & Measurement — Enable custom signal conditioning, timing, and data capture implementations leveraging high I/O counts and embedded memory.
Unique Advantages
- Large, integrated logic fabric: 952,000 logic elements allow consolidation of multi-function subsystems into a single device, reducing BOM and board area.
- Substantial on-chip memory: Approximately 53 Mbits of embedded RAM minimizes dependency on external memory for buffering and state retention.
- High I/O density: 840 I/O pins provide flexibility for wide parallel interfaces and multiple peripheral connections without external multiplexing.
- Compact, assembly-ready package: 1932-BBGA FCBGA in a 45×45 supplier package supports high-density surface-mount assembly for space-constrained designs.
- Commercial operating range: Specified 0 °C to 85 °C supports a wide range of non-industrial applications and standard deployed electronics.
- RoHS compliant: Meets common environmental compliance requirements for global manufacturing and distribution.
Why Choose 5SGXEABN1F45C2LN?
The 5SGXEABN1F45C2LN provides a high-capacity Stratix V GX FPGA option for developers who need large logic resources, substantial embedded memory, and extensive I/O in a single surface-mount package. Its combination of 952,000 logic elements, roughly 53 Mbits of on-chip RAM, and 840 I/Os makes it suitable for complex digital designs where integration and board-space efficiency matter.
Engineers designing advanced embedded systems, communications equipment, or high-performance test platforms will find the device a practical choice for consolidating functions and reducing external component count while operating within standard commercial temperature limits. RoHS compliance and a defined core voltage range simplify system-level power planning and manufacturing compliance.
If you would like pricing, availability, or to submit a quote request for the 5SGXEABN1F45C2LN, please request a quote or submit an inquiry to our sales channel for a prompt response.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018