5SGXEABN1F45C2LN

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 53248000 952000 1932-BBGA, FCBGA

Quantity 1,394 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs359200Number of Logic Elements/Cells952000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXEABN1F45C2LN – Stratix V GX Field Programmable Gate Array (FPGA) IC

The 5SGXEABN1F45C2LN is a Stratix V GX family FPGA in a 1932-BBGA FCBGA package, designed for commercial embedded and board-level applications. It offers a large logic fabric and significant on-chip memory, combined with a high I/O count and a compact surface-mount package suitable for dense system designs.

Targeted use cases include complex digital signal processing, high-channel I/O control, and advanced programmable logic implementations where high gate counts and embedded memory capacity are required. The device is RoHS compliant and rated for commercial operation.

Key Features

  • High Logic Density — 952,000 logic elements to implement large, complex designs and deep custom logic.
  • Significant Embedded Memory — Approximately 53 Mbits of on-chip RAM to support large buffering, FIFOs, and state storage without external memory.
  • Extensive I/O — 840 user I/O pins for wide parallel interfaces, high-channel count connectivity, and flexible board-level routing.
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial applications.
  • Low-Voltage Core — Core supply specified at 820 mV to 880 mV to align with modern low-voltage system architectures.
  • Package and Mounting — 1932-BBGA, FCBGA (supplier package: 1932-FBGA, FC 45×45) in a surface-mount form factor for compact board layouts.
  • Regulatory Compliance — RoHS compliant for environmental and manufacturing compliance needs.

Typical Applications

  • Telecommunications and Networking — Implement high-density packet processing, protocol bridging, and programmable dataplane functions using the device's large logic and memory resources.
  • High-Performance Embedded Systems — Use for custom accelerators, DSP pipelines, and control logic where on-chip RAM and abundant logic elements reduce external components.
  • Industrial Control and Instrumentation — Support complex control algorithms and multi-channel I/O aggregation within the commercial temperature range.
  • Test & Measurement — Enable custom signal conditioning, timing, and data capture implementations leveraging high I/O counts and embedded memory.

Unique Advantages

  • Large, integrated logic fabric: 952,000 logic elements allow consolidation of multi-function subsystems into a single device, reducing BOM and board area.
  • Substantial on-chip memory: Approximately 53 Mbits of embedded RAM minimizes dependency on external memory for buffering and state retention.
  • High I/O density: 840 I/O pins provide flexibility for wide parallel interfaces and multiple peripheral connections without external multiplexing.
  • Compact, assembly-ready package: 1932-BBGA FCBGA in a 45×45 supplier package supports high-density surface-mount assembly for space-constrained designs.
  • Commercial operating range: Specified 0 °C to 85 °C supports a wide range of non-industrial applications and standard deployed electronics.
  • RoHS compliant: Meets common environmental compliance requirements for global manufacturing and distribution.

Why Choose 5SGXEABN1F45C2LN?

The 5SGXEABN1F45C2LN provides a high-capacity Stratix V GX FPGA option for developers who need large logic resources, substantial embedded memory, and extensive I/O in a single surface-mount package. Its combination of 952,000 logic elements, roughly 53 Mbits of on-chip RAM, and 840 I/Os makes it suitable for complex digital designs where integration and board-space efficiency matter.

Engineers designing advanced embedded systems, communications equipment, or high-performance test platforms will find the device a practical choice for consolidating functions and reducing external component count while operating within standard commercial temperature limits. RoHS compliance and a defined core voltage range simplify system-level power planning and manufacturing compliance.

If you would like pricing, availability, or to submit a quote request for the 5SGXEABN1F45C2LN, please request a quote or submit an inquiry to our sales channel for a prompt response.

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