5SGXEABN1F45C2L

The 5SGXEABN1F45C2L is a Stratix® V GX field programmable gate array (FPGA) offered in a 1932-ball FCBGA package for surface-mount assembly. This commercial-grade device provides a high density of programmable logic and on-chip memory with a large I/O count for demanding, high-capacity digital designs.

With 952,000 logic elements and approximately 53.248 Mbits of embedded memory, the device is suited to applications that require high integration, substantial on-chip RAM, and extensive I/O connectivity. The device operates from a core supply range of 820 mV to 880 mV and is specified for commercial temperature operation from 0 °C to 85 °C.

Key Features

• Core Logic — 952,000 logic elements providing a high density of programmable logic for complex digital designs.
• Embedded Memory — Approximately 53.248 Mbits of on-chip RAM to support large buffers, lookup tables, and state storage.
• I/O Capacity — 840 user I/O pins, enabling extensive external device interfacing and parallel connectivity.
• Power — Core voltage supply range of 820 mV to 880 mV for the device core.
• Package & Mounting — 1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45); surface-mount device.
• Operating Range — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory — RoHS compliant.

Typical Applications

• High-density programmable systems — Designs requiring a large number of logic elements and substantial embedded RAM.
• High I/O-count interfaces — Systems that need extensive external connectivity through up to 840 I/O pins.
• Board-level integration — Surface-mount, high-pin-count FPGA implementations where compact, high-density packages are required.

Unique Advantages

• High logic capacity: 952,000 logic elements allow implementation of large, complex digital functions on a single device.
• Significant on-chip memory: Approximately 53.248 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs.
• Extensive I/O: 840 I/O pins provide flexibility for parallel interfaces, dense board-level connectivity, and multiple peripherals.
• Compact high-pin-count package: 1932-ball FCBGA package supports high integration in a surface-mount form factor (45×45 mm supplier footprint).
• Commercial temperature rating: Specified operation from 0 °C to 85 °C for standard commercial applications.
• RoHS compliant: Conforms to RoHS environmental requirements.

Why Choose 5SGXEABN1F45C2L?

The 5SGXEABN1F45C2L positions itself as a high-density Stratix V GX FPGA for designers who need substantial on-chip logic, memory, and I/O in a single commercial-grade package. Its combination of 952,000 logic elements, approximately 53.248 Mbits of embedded RAM, and 840 I/O pins supports consolidation of complex functions and reduces external component count.

This device is well suited to development teams and OEMs focused on scalable, board-level FPGA implementations where integration, I/O capacity, and on-chip memory are primary considerations. Its surface-mount 1932-ball FCBGA package and RoHS compliance support modern assembly and environmental requirements.

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