5SGXEABN1F45I2

The 5SGXEABN1F45I2 is a Stratix® V GX field programmable gate array (FPGA) in a 1932-ball BGA FCBGA package, designed for high-density, high-bandwidth applications. Based on the Stratix V family architecture, it combines a large logic fabric with substantial embedded memory and a high I/O count to support data-intensive designs.

Targeted markets include optical transport, packet processing, traffic management, and communications test equipment where large logic capacity, abundant I/O, and industrial temperature operation are required.

Key Features

• Logic Capacity — 952,000 logic elements to implement large, complex digital designs.
• Embedded Memory — Approximately 53 Mbits of on-chip RAM (53,248,000 bits) using Stratix V embedded memory resources.
• I/O Density — 840 general-purpose I/O pins for broad connectivity to high-pin-count systems.
• Transceiver and Fabric Architecture — Stratix V GX family architecture with integrated high-speed transceiver capability (GX variant characteristics described in the device family), plus a redesigned adaptive logic module (ALM), variable-precision DSP blocks, and fractional PLLs as part of the Stratix V feature set.
• Process and Core — 28‑nm process technology and low-voltage core operation; device voltage supply range is 870 mV to 930 mV.
• Package and Mounting — 1932-ball BGA (1932-BBGA, FCBGA); supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount package supports compact system integration.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Design Migration — Stratix V devices support prototyping and a defined path to HardCopy ASICs for volume transitions (family-level capability described in product documentation).

Typical Applications

• Optical Transport and Switching — Implement high-bandwidth packet processing and protocol handling for 40G/100G optical transport systems.
• Network Packet Processing — Use large logic capacity and high I/O counts for packet parsing, traffic management, and wireline communications equipment.
• Test and Measurement Equipment — Leverage dense logic and embedded memory for real‑time signal processing and protocol test functions.
• Military and Communications Systems — Industrial temperature rating and high integration make the device suitable for rugged communications platforms and related subsystems.

Unique Advantages

• High logic integration: 952,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level complexity.
• Substantial on-chip RAM: Approximately 53 Mbits of embedded memory supports large buffering and on-chip data structures, minimizing external memory dependency.
• Large I/O complement: 840 I/O pins provide the flexibility to interface with dense front-end systems and wide buses without external expanders.
• Industrial operating range: Rated −40 °C to 100 °C to meet temperature demands of industrial and ruggedized equipment.
• Compact, high-pin-count package: 1932-ball BGA (45×45) enables a high-density implementation while maintaining a standard surface-mount assembly flow.
• Family-level silicon features: Stratix V architecture includes ALMs, M20K memory blocks, variable-precision DSP blocks, and fractional PLLs to accelerate implementation of signal-processing and protocol functions.

Why Choose 5SGXEABN1F45I2?

The 5SGXEABN1F45I2 combines a very large logic element count, significant embedded memory, and a high I/O complement in a single industrial-grade BGA package. It is positioned for designs that require sustained bandwidth, extensive on-chip resources, and reliable operation across a wide temperature range.

This FPGA is suited to engineering teams building high-performance communications, networking, and test equipment who need scalable logic capacity and integrated fabric features provided by the Stratix V family.

Request a quote or submit a pricing and availability request to obtain lead-time and procurement information for the 5SGXEABN1F45I2.