5SGXEABN1F45I2N

The 5SGXEABN1F45I2N is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, designed for high-density programmable logic applications. This device integrates 952,000 logic elements and approximately 53 Mbits of embedded memory, delivering a platform suitable for designs that require large logic capacity, substantial on-chip RAM, and a high I/O count.

Key Features

• Core & Logic  952,000 logic elements (logic cells) provide substantial programmable fabric for complex custom logic and compute functions.
• Embedded Memory  Approximately 53 Mbits of total on-chip RAM for buffering, packet processing, and memory-intensive logic tasks.
• I/O Density  840 user I/Os to support high-channel-count interfacing and parallel connectivity requirements.
• Package & Mounting  1932-BBGA FCBGA package (supplier device package: 1932-FBGA, FC, 45×45) in a surface-mount format for board-level integration.
• Power  Core voltage supply range 870 mV–930 mV for the programmable core domain.
• Temperature & Grade  Industrial grade device with an operating temperature range of –40 °C to 100 °C for demanding environmental conditions.
• RoHS Status  RoHS compliant.

Typical Applications

• High-density compute and acceleration  Leverage 952,000 logic elements and substantial embedded memory to implement custom compute kernels and data-path acceleration.
• High-channel I/O systems  Use the 840 I/Os for multi-channel data acquisition, aggregation, and interfacing in dense system designs.
• Industrial and rugged equipment  Industrial grade rating and –40 °C to 100 °C operating range make it suitable for industrial control and automation applications.
• Board-level, surface-mount designs  The 1932-BBGA FCBGA package supports compact, high-pin-count surface-mount implementations.

Unique Advantages

• Large programmable fabric: 952,000 logic elements provide headroom for complex, parallelizable logic and system integration on a single device.
• Significant on-chip memory: Approximately 53 Mbits of embedded RAM reduces dependence on external memory for many buffering and processing tasks.
• High I/O capacity: 840 I/Os simplify system partitioning and reduce the need for additional interface chips when connecting many peripherals or channels.
• Industrial temperature capability: Rated –40 °C to 100 °C to sustain operation in harsh and temperature-variable environments.
• Surface-mount FCBGA package: 1932-ball FCBGA in a 45×45 footprint supports high-density PCB layouts and reliable board-level assembly.
• Standards-aligned compliance: RoHS compliant to support regulatory requirements for lead-free assembly.

Why Choose 5SGXEABN1F45I2N?

The 5SGXEABN1F45I2N positions itself as a high-capacity Stratix V GX FPGA suitable for designs that demand large logic resources, extensive embedded memory, and a very high I/O count within an industrial temperature envelope. Its FCBGA 1932-ball package and surface-mount mounting type enable compact, board-level implementations where density and I/O integration are critical.

For development teams and procurement focused on long-lived projects, this device is supported by the Stratix V family documentation and datasheet reference material, providing the electrical and switching characteristics needed for system design and validation.

Request a quote or submit an inquiry to obtain pricing, availability, and ordering details for the 5SGXEABN1F45I2N Stratix V GX FPGA.