5SGXEABN2F45C2LG

The 5SGXEABN2F45C2LG is a Stratix V GX family FPGA delivered in a 1932-BBGA (FCBGA) package. It provides a very high logic density and large embedded memory capacity in a commercial-grade device intended for complex programmable logic integration.

This device is specified for a core supply range of 820 mV to 880 mV, supports up to 840 I/O, and is rated for commercial operating temperatures from 0 °C to 85 °C. It is RoHS compliant and documented in the Stratix V device datasheet covering electrical and switching characteristics.

Key Features

• Core density  Approximately 952,000 logic elements for large-scale logic integration and consolidation of multiple functions on a single device.
• On-chip memory  Approximately 53.25 Mbits of embedded memory for frame buffering, lookup tables, and state storage.
• I/O capacity  Up to 840 I/O pins to support dense peripheral and interconnect requirements.
• Package  1932-BBGA, FCBGA (supplier device package: 1932-FBGA, FC, 45×45 mm) for a compact, high-pin-count footprint.
• Power  Core voltage supply range of 820 mV to 880 mV to match controlled-power rail designs.
• Mounting  Surface-mount package suitable for modern PCB assembly.
• Temperature & grade  Commercial grade, specified for 0 °C to 85 °C operation.
• Compliance  RoHS compliant.

Typical Applications

• Large-scale programmable logic  Consolidate complex digital functions across approximately 952,000 logic elements to reduce external components.
• Memory-intensive designs  Exploit approximately 53.25 Mbits of embedded memory for buffering, packet storage, and on-chip data structures.
• High I/O systems  Use the device’s up to 840 I/O pins to interface with dense sensor arrays, high-channel-count peripherals, or multi-lane interconnects.
• Commercial embedded systems  Designed for applications and products that operate across the commercial temperature range (0 °C–85 °C).

Unique Advantages

• Very high logic density:  Approximately 952,000 logic elements enable integration of large custom datapaths and state machines on a single device.
• Substantial embedded memory:  Approximately 53.25 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage tasks.
• Extensive I/O count:  Up to 840 I/O pins simplify board-level routing and lower the need for additional I/O expanders.
• Compact, high-pin-count package:  1932-BBGA (45×45 mm supplier package) delivers high integration density while keeping PCB footprint efficient.
• Narrow core-voltage window:  820 mV–880 mV supply range supports controlled power-rail design and predictable core operation.
• Commercial-grade qualification:  Specified for 0 °C–85 °C operation and RoHS compliant for standard commercial product environments.

Why Choose 5SGXEABN2F45C2LG?

The 5SGXEABN2F45C2LG combines a very high logic element count, substantial on-chip memory, and a large I/O complement in a single Stratix V GX FPGA package. Its electrical characteristics and switching behavior are documented in the Stratix V device datasheet, making it suitable for teams designing consolidated, high-density programmable logic solutions within commercial temperature ranges.

This part is appropriate for customers requiring scalability in logic and memory capacity while minimizing external component count and preserving board area through a compact 1932-FBGA package. The device’s defined supply and thermal specifications help simplify system-level power and thermal planning.

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