5SGXEABN2F45C3G

The 5SGXEABN2F45C3G is a Stratix® V GX field-programmable gate array (FPGA) IC from Intel, offered in a 1932‑BGA FCBGA package. This commercial-grade device provides large on‑chip resources—952,000 logic elements and approximately 53.25 Mbits of embedded memory—along with up to 840 user I/O pins to support complex digital designs.

Designed for high-density integration, the device targets applications that require significant logic capacity, substantial embedded RAM, and high I/O counts while operating on a low-voltage core supply.

Key Features

• Logic Capacity  952,000 logic elements for large-scale digital designs and system integration.
• Embedded Memory  Approximately 53.25 Mbits of on‑chip RAM to support buffering, look-up tables, and memory-intensive functions.
• I/O Density  Up to 840 user I/O pins to accommodate wide data buses, multi‑lane interfaces, and dense peripheral connectivity.
• Core Voltage  Core supply range from 820 mV to 880 mV for low-voltage operation.
• Package and Mounting  1932‑BBGA (FCBGA) package; supplier device package listed as 1932‑FBGA, FC (45×45). Surface-mount mounting type for modern PCB assembly.
• Operating Range & Grade  Commercial temperature grade with an operating temperature range of 0 °C to 85 °C.
• Standards Compliance  RoHS compliant.
• Documentation  Device-specific electrical and switching characteristics are provided in the Stratix V device datasheet for detailed design guidance.

Typical Applications

• High‑density digital signal processing  Large logic and embedded memory capacity enable complex DSP algorithms and buffering on a single device.
• Networking and communications  High I/O count and Stratix V GX family transceiver capabilities (documented in the device family datasheet) suit multi‑lane interfaces and board‑level aggregation.
• Compute acceleration  Substantial logic resources and on‑chip RAM support offload of compute kernels and hardware acceleration functions.

Unique Advantages

• High integration density: Combines nearly one million logic elements with large embedded RAM to consolidate complex systems into a single FPGA.
• Broad I/O capability: Up to 840 I/Os reduce the need for external interface chips and simplify board routing for multi‑channel designs.
• Compact FCBGA package: 1932‑BBGA (45×45) package enables dense board layouts while supporting surface‑mount assembly.
• Low-voltage core operation: 820–880 mV core supply supports modern low-power power‑rail architectures.
• Commercial temperature rating: Suitable for a wide range of commercial applications with an operating range of 0 °C to 85 °C.
• Regulatory compliance: RoHS compliance for lead‑free manufacturing flows.

Why Choose 5SGXEABN2F45C3G?

The 5SGXEABN2F45C3G delivers substantial logic capacity, significant embedded memory, and a high I/O count in a single commercial‑grade Stratix V GX FPGA. It is well suited for designs that demand dense logic resources and extensive board‑level connectivity while operating on a low-voltage core rail.

Backed by the Stratix V device documentation, this device provides the technical references needed to assess electrical and switching characteristics, helping engineering teams integrate the FPGA reliably into complex systems.

If you would like pricing or availability, request a quote or submit an inquiry to initiate the procurement process.