5SGXEABN2F45I2L

The 5SGXEABN2F45I2L is a Stratix V GX Field Programmable Gate Array (FPGA) device designed for high-density, I/O‑rich system implementations. It integrates a large logic fabric and substantial on‑chip RAM in a 1932-ball FCBGA package for surface-mount assembly.

Targeted at industrial-grade applications, this device combines 952,000 logic elements, approximately 53.25 Mbits of embedded memory, and 840 user I/Os, with a core supply range of 820 mV to 880 mV and an operating temperature range of −40 °C to 100 °C.

Key Features

• Core & Logic Capacity 952,000 logic elements provide a very high-density programmable fabric suitable for complex logic, datapath, and control implementations.
• Embedded Memory Approximately 53.25 Mbits of on-chip RAM to support buffering, look-up tables, and memory-centric algorithms without relying solely on external memory.
• I/O and Packaging 840 user I/Os delivered in a 1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45), mounted via surface-mount technology.
• Power Core voltage supply specified from 820 mV to 880 mV, enabling low-voltage core operation consistent with the Stratix V family electrical characteristics.
• Temperature and Grade Industrial temperature grade with an operating range of −40 °C to 100 °C for deployment in demanding environmental conditions.
• Compliance RoHS compliant to meet standard regulatory requirements for lead-free assembly.

Typical Applications

• High‑performance signal processing — Large logic capacity and substantial embedded RAM support complex DSP pipelines and real‑time data processing.
• Networking and packet processing — High I/O count and dense logic enable protocol handling, packet parsing, and traffic management implementations.
• Storage and compute accelerators — On‑chip memory and logic resources allow implementation of custom acceleration engines and buffering strategies.
• Industrial control and automation — Industrial temperature rating and robust packaging suit infrastructure and factory automation systems requiring reliable operation.

Unique Advantages

• High integration density: 952,000 logic elements and ~53.25 Mbits of embedded RAM reduce the need for external logic and memory components.
• Extensive I/O resources: 840 I/Os enable direct interfacing to many peripherals and high‑port-count systems without intermediary multiplexing.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in harsh and temperature‑variable environments.
• Compact FCBGA packaging: 1932-ball FCBGA (45×45) provides a high‑density, surface‑mount solution for space‑constrained PCBs.
• Low‑voltage core operation: 0.82–0.88 V supply range supports power-optimized system designs.
• RoHS compliance: Facilitates lead‑free manufacturing and regulatory conformity.

Why Choose 5SGXEABN2F45I2L?

The 5SGXEABN2F45I2L delivers a combination of very high logic density, significant on‑chip memory, and an extensive I/O count in an industrial‑rated Stratix V GX package. It is well suited for designers building complex, performance‑oriented systems that require integrated memory resources and dense external interfacing while maintaining industrial temperature resilience.

Engineers and procurement teams looking for a scalable, high‑capacity FPGA for compute‑intensive, I/O‑heavy, or industrial applications will find this device a compelling option thanks to its combination of capacity, package density, and specified operating conditions.

Request a quote or submit a procurement inquiry for part number 5SGXEABN2F45I2L to begin a pricing or availability conversation with our team.