5SGXEABN2F45I2N

The 5SGXEABN2F45I2N is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel. It delivers a high-density programmable logic fabric with 952,000 logic elements and approximately 53.25 Mbits of embedded memory for large, complex designs.

Key device characteristics include 840 user I/Os, a surface-mount 1932-ball FCBGA package (45 × 45 mm), industrial-grade operating range (–40 °C to 100 °C), and a core supply range of 870 mV to 930 mV—making it suitable for high-density, high-I/O applications that require industrial temperature performance.

Key Features

• High-density logic — 952,000 logic elements to implement large FPGA designs and complex custom logic functions.
• Embedded memory — Approximately 53.25 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
• Extensive I/O capability — 840 I/O pins to support wide bus interfaces, parallel data paths, and multi-channel systems.
• High-speed transceiver capability (series) — Stratix V GX device family transceiver speed grades documented in the series datasheet include up to 14.1 Gbps and 12.5 Gbps channels, providing options for high-speed serial links.
• Power and core supply — Core voltage specified from 870 mV to 930 mV for validated operating conditions.
• Package and mounting — 1932-ball FCBGA (1932-BBGA) supplier device package, 45 × 45 mm; designed for surface-mount PCB assembly.
• Industrial temperature grade — Rated for operation from –40 °C to 100 °C to meet industrial thermal requirements.
• Regulatory status — RoHS compliant.

Typical Applications

• High-speed communications — Implement multi‑channel serial interfaces and protocol processing using Stratix V GX transceiver speed grades documented for high data-rate links.
• High-density logic systems — Replace or augment ASICs and complex glue logic where large numbers of logic elements and embedded RAM are required.
• Multi‑I/O control — Support systems that require many parallel interfaces, extensive sensor or actuator connectivity, and wide bus support with 840 I/Os.
• Industrial applications — Deploy in environments requiring industrial temperature operation (–40 °C to 100 °C) and surface-mount integration.

Unique Advantages

• Massive programmable capacity: 952,000 logic elements enable highly complex logic designs without immediate need to partition across multiple devices.
• Large on‑chip memory: Approximately 53.25 Mbits of embedded RAM reduces external memory dependence and simplifies board-level BOM.
• Wide I/O availability: 840 user I/Os provide flexibility for dense, multi‑channel interfaces and parallel data processing.
• Industrial temperature rating: Specified –40 °C to 100 °C supports deployment in temperature-challenging environments.
• Dense FCBGA packaging: 1932-ball FCBGA (45 × 45 mm) enables high pin-count integration in a compact footprint for advanced PCB layouts.
• RoHS compliant and vendor-backed: Device is RoHS compliant and manufactured by Intel (Altera), providing traceability to a major FPGA vendor.

Why Choose 5SGXEABN2F45I2N?

The 5SGXEABN2F45I2N positions itself as a high-density, high-I/O Stratix V GX FPGA for engineers who need substantial programmable logic, substantial on-chip memory, and large I/O counts in an industrial-temperature-rated package. Its documented Stratix V GX family transceiver capabilities and the device’s electrical specifications support designs that demand high throughput and integration.

This part is suited to teams building complex custom logic, multi‑channel interface systems, or industrial applications that require sustained operation across a wide temperature range—backed by Intel’s Stratix V device documentation and manufacturing pedigree.

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