5SGXEABN2F45I3LG

The 5SGXEABN2F45I3LG is a Stratix V GX Field Programmable Gate Array (FPGA) IC designed for high-density, industrial-grade applications. It provides a large logic resource pool and substantial on-chip memory in a 1932-ball FCBGA package, supporting designs that require extensive programmable logic, abundant I/O, and controlled core-voltage operation.

Key Features

• Logic Capacity  952,000 logic elements for complex, large-scale digital designs and resource-heavy algorithms.
• Embedded Memory  Approximately 53.2 Mbits of on-chip RAM to support buffering, LUT-based storage, and data-path requirements.
• I/O Resources  840 device I/Os to enable wide parallel connectivity and large external interface integration.
• Power Supply  Core supply range 820 mV to 880 mV to match defined operating voltage requirements.
• Package & Mounting  1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount device suitable for board-level integration.
• Temperature & Grade  Industrial-grade device with an operating temperature range of −40 °C to 100 °C for deployment in thermally demanding environments.
• Regulatory Compliance  RoHS-compliant to support lead-free assembly and environmental compliance needs.
• Stratix V Family Documentation  Device follows Stratix V GX family electrical and switching-characteristic definitions as documented in the Stratix V device datasheet.

Unique Advantages

• High-density programmable logic: 952,000 logic elements allow consolidation of multiple functions into a single FPGA, reducing part count and system complexity.
• Significant on-chip RAM: Approximately 53.2 Mbits of embedded memory reduces dependence on external memory for buffering and accelerates data-path operations.
• Extensive I/O capability: 840 I/Os support broad peripheral integration and parallel interfaces without additional bridge logic.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in a wide range of industrial environments.
• Compact, production-ready package: 1932-ball FCBGA in a 45×45 supplier package footprint enables high-density PCB routing while supporting surface-mount assembly.
• Standards-conscious design: RoHS compliance facilitates lead-free manufacturing workflows and simplifies regulatory tracking.

Why Choose 5SGXEABN2F45I3LG?

The 5SGXEABN2F45I3LG delivers a combination of very high logic density, substantial embedded memory, and extensive I/O in an industrial-grade Stratix V GX FPGA. Its defined core-voltage range and FCBGA packaging make it suitable for systems that require concentrated programmable resources in a production-ready form factor. Engineers and procurement teams selecting this device benefit from a clear specification set for temperature, supply, package, and resource counts—supporting reliable integration into demanding electronic designs.

Ideal for development teams targeting large-scale FPGA implementations that require on-chip memory and high pin counts, this Stratix V GX device offers measurable hardware resources and documented electrical characteristics for design planning and system validation.

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