5SGXEABN2F45I3LN

The 5SGXEABN2F45I3LN is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 1932-BBGA FCBGA package. It provides very large programmable logic capacity combined with extensive on-chip RAM and high I/O counts for demanding industrial applications.

Designed for high-density programmable logic implementations, this industrial-grade device targets systems that require significant embedded memory, broad I/O capability, and a compact high-pin-count package. The device’s operating voltage and temperature specifications support deployment in extended-temperature environments.

Key Features

• Logic Capacity  Provides 952,000 logic element cells to implement complex programmable logic and large-scale designs.
• Embedded Memory  Includes approximately 53.248 Mbits of on-chip RAM for data buffering, state storage, and memory-intensive logic functions.
• I/O Density  Offers 840 user I/Os to support wide bus interfaces, parallel peripherals, and high pin-count system connectivity.
• Package & Mounting  Supplied in a 1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount mounting type supports standard PCB assembly.
• Power Supply  Core voltage supply range of 820 mV to 880 mV to match system power-rail requirements.
• Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for extended-temperature deployments.
• Stratix V GX Family  Device belongs to the Stratix V GX series; transceiver and speed-grade options for Stratix V GX devices are documented in the Stratix V device datasheet.
• Standards & Compliance  RoHS compliant per supplied product data.

Typical Applications

• High-density programmable logic systems  Use the device to implement large custom logic blocks and complex finite-state machines where high logic capacity is required.
• Memory-intensive designs  On-chip RAM (approximately 53.248 Mbits) supports buffering, packet processing, and intermediate data storage within the FPGA fabric.
• High I/O count systems  With 840 I/Os, the device suits systems that require many parallel interfaces, dense connector implementations, or extensive peripheral integration.
• Industrial and extended-temperature applications  Industrial-grade temperature rating (−40 °C to 100 °C) allows use in environments with wide temperature swings.

Unique Advantages

• High logic density: 952,000 logic element cells enable implementation of very large digital designs without external logic expansion.
• Significant on-chip memory: Approximately 53.248 Mbits of embedded RAM reduces dependency on external memory for many buffering and storage tasks.
• Extensive I/O resources: 840 I/Os provide flexibility for parallel interfaces, multiple peripherals, and complex board-level connectivity.
• Industrial temperature capability: −40 °C to 100 °C rating supports deployment in extended-temperature industrial environments.
• Compact, high-pin-count package: 1932-BBGA / 1932-FBGA (45×45) packaging concentrates a large number of signals in a compact footprint for dense PCB designs.
• Low-voltage core operation: Core supply range of 820 mV to 880 mV aligns with modern low-voltage FPGA power domains.

Why Choose 5SGXEABN2F45I3LN?

The 5SGXEABN2F45I3LN positions itself as a high-capacity, industrial-grade FPGA option within the Stratix V GX family, combining nearly one million logic element cells, plentiful embedded memory, and a high I/O count in a compact 1932-BBGA package. Its voltage and temperature ratings make it suitable for designs that require robust operation across extended-temperature ranges while maintaining a low-voltage core.

This part is suited for engineering teams building complex, memory-hungry programmable logic systems that demand dense I/O and a compact board footprint. The device’s specification set supports scalable implementations and provides predictable integration points for long-term product deployments backed by the Stratix V device documentation.

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