5SGXEABN2F45I3L

The 5SGXEABN2F45I3L is a Stratix V GX Field Programmable Gate Array (FPGA) designed for industrial-grade system designs that require very large programmable logic capacity, abundant I/O, and substantial on-chip memory.

Built in a 1932-ball FCBGA package and specified for surface-mount assembly, this device provides a combination of approximately 952,000 logic elements and about 53.248 Mbits of embedded RAM suitable for high-density digital implementations within the industrial temperature range.

Key Features

• Logic Capacity  Approximately 952,000 logic elements to implement large-scale custom logic, state machines, and data-path operators.
• Embedded Memory  Approximately 53.248 Mbits of on-chip RAM for buffering, FIFOs, and local storage of intermediate data.
• High I/O Count  Up to 840 general-purpose I/O pins to support wide parallel interfaces and multi-channel I/O requirements.
• Package & Mounting  1932-BBGA (FCBGA) package, Supplier Device Package: 1932-FBGA, FC (45×45); surface-mount device for dense board-level integration.
• Operating Conditions  Industrial-grade device rated for operation from −40 °C to 100 °C, addressing a wide thermal range for industrial applications.
• Core Supply  Core voltage specified between 820 mV and 880 mV to meet the device power requirements.
• Regulatory  RoHS compliant.

Typical Applications

• High-capacity programmable logic  Implement complex, large-scale digital functions and custom processing pipelines using the device's extensive logic resource pool.
• I/O-intensive systems  Support wide parallel buses, multi-channel interfaces, and dense connectivity with up to 840 I/O pins.
• Embedded memory-dependent designs  Leverage approximately 53.248 Mbits of on-chip RAM for local buffering, packet storage, or data staging without excessive external memory reliance.
• Industrial equipment  Designed and specified for industrial temperature operation (−40 °C to 100 °C) for deployment in factory automation, instrumentation, and control platforms.

Unique Advantages

• Very large logic fabric  Approximately 952,000 logic elements reduce the need for multiple devices and simplify partitioning of complex functions.
• Substantial on-chip RAM  About 53.248 Mbits of embedded memory enables high-performance local storage and lowers dependence on external memory components.
• High pin count  840 I/Os deliver the routing capacity required for multi-channel and parallel interfaces, minimizing external bridging logic.
• Industrial temperature rating  Specified operation from −40 °C to 100 °C supports deployment in thermally demanding industrial environments.
• Dense FCBGA package  1932-ball FCBGA (45×45) package enables high integration density for space-constrained board designs.
• RoHS compliant  Meets regulatory requirements for lead-free assemblies and environmentally conscious manufacturing.

Why Choose 5SGXEABN2F45I3L?

5SGXEABN2F45I3L positions itself as a high-capacity Stratix V GX option for engineers who need extensive programmable logic, large embedded memory, and plentiful I/O in an industrial-grade FPGA. Its FCBGA package and surface-mount construction make it suitable for compact, high-density system boards.

The combination of approximately 952,000 logic elements, roughly 53.248 Mbits of on-chip RAM, 840 I/Os, and an industrial temperature range makes this device a practical choice for complex digital designs that require sustained operation across a wide thermal envelope.

Request a quote or submit an inquiry to evaluate 5SGXEABN2F45I3L for your next design project and obtain pricing and availability information.