5SGXEABN2F45I3N

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 53248000 952000 1932-BBGA, FCBGA

Quantity 342 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs359200Number of Logic Elements/Cells952000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXEABN2F45I3N – Stratix® V GX Field Programmable Gate Array, 952,000 logic elements

The 5SGXEABN2F45I3N is a Stratix V GX Field Programmable Gate Array (FPGA) offered in an industrial temperature grade. It combines a very high logic element count with a large pool of on‑chip RAM and extensive I/O to address complex, compute‑ and I/O‑intensive embedded designs.

This device is delivered in a high‑density 1932‑FBGA/1932‑BBGA package for surface‑mount PCB integration and operates from a core supply of 0.820 V to 0.880 V with an operating temperature range of −40 °C to 100 °C.

Key Features

  • High‑density logic 952,000 logic elements to implement large-scale digital designs and complex algorithms.
  • Substantial embedded memory Approximately 53.25 Mbits of on‑chip RAM for buffering, lookup tables, and data‑path storage.
  • Extensive I/O 840 user I/Os to support wide parallel interfaces, multiple peripherals, and board-level connectivity.
  • Series-level transceiver capability Part of the Stratix V GX family; the series datasheet documents GX transceiver speed grades (refer to the device datasheet for specific part-level transceiver grade information).
  • Low-voltage core Core supply range of 0.820 V to 0.880 V to align with low-voltage power domains.
  • Industrial temperature grade Rated for operation from −40 °C to 100 °C for deployment in temperature‑sensitive industrial applications.
  • Package & mounting 1932‑BBGA / FCBGA (supplier package: 1932‑FBGA, FC 45×45) in a surface‑mount form factor for high‑density PCB layouts.
  • RoHS compliant Meets RoHS environmental compliance requirements.

Typical Applications

  • Communications & Networking — High logic density and abundant on‑chip RAM support packet processing, protocol offload, and multi‑lane interface bridging.
  • Data Center & Acceleration — Large logic and memory resources enable custom accelerators and hardware offload functions for compute‑intensive workloads.
  • High‑Performance Signal Processing — Extensive logic fabric and memory support real‑time DSP pipelines and complex filtering tasks.
  • Industrial Control & Automation — Industrial temperature grade and high I/O count provide robust platform options for motor control, I/O aggregation, and deterministic control logic.

Unique Advantages

  • Highly integrated compute resources: 952,000 logic elements plus substantial embedded RAM reduce the need for external processors and memory in complex designs.
  • Large I/O capacity: 840 user I/Os enable direct interfacing to many peripherals and high‑pin‑count systems without extensive bridge logic.
  • Industrial robustness: −40 °C to 100 °C operating range supports deployment in demanding environments.
  • Optimized power domain: Narrow core voltage range (0.820 V–0.880 V) facilitates efficient power budgeting and integration with modern power rails.
  • Board‑level density in a surface‑mount package: 1932‑FBGA/BBGA package provides a compact footprint for high‑performance boards.
  • Environmentally compliant: RoHS status supports environmentally conscious design and regulatory requirements.

Why Choose 5SGXEABN2F45I3N?

The 5SGXEABN2F45I3N delivers a combination of very high logic capacity, substantial embedded memory, and broad I/O count in an industrial‑rated Stratix V GX FPGA. It is positioned for engineers who need to consolidate complex digital functions, large buffering, and high connectivity into a single device while maintaining operation across wide temperature ranges.

This device is suitable for teams building high‑performance communications, data‑acceleration, signal‑processing, and industrial control systems that require scalable logic, on‑chip RAM, and a reliable, surface‑mount BGA package backed by the Stratix V family documentation and specifications.

Request a quote or submit a pricing and availability request for 5SGXEABN2F45I3N to review lead times and volume options for your next design.

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