5SGXEABN2F45I3G

The 5SGXEABN2F45I3G is an Intel Stratix® V GX field programmable gate array (FPGA) delivered in a 1932-ball FCBGA package. It provides very high logic density and on-chip memory capacity alongside extensive I/O connectivity for complex, high-integration designs.

This device is specified for industrial-grade operation with a core supply range of 820 mV to 880 mV and an operating temperature range of −40°C to 100°C, making it suitable for demanding environments where thermal and voltage characteristics are critical.

Key Features

• Core Logic  952,000 logic elements enable large-scale programmable logic integration for complex algorithms and system functions.
• Embedded Memory  Approximately 53.25 Mbits of embedded memory for buffering, lookup tables, and on-chip data storage.
• I/O Count  840 programmable I/O pins provide broad connectivity for high-pin-count system designs and board-level interfaces.
• Power and Voltage  Core voltage supply specified from 820 mV to 880 mV to match system power-rail requirements and planning.
• Package and Mounting  1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount mounting type for PCB integration.
• Temperature Grade  Industrial grade with an operating temperature range of −40°C to 100°C, suitable for extended-environment deployments.
• Compliance  RoHS compliant to support environmental and regulatory requirements.

Typical Applications

• High-density signal processing  Use the large logic element count and on-chip memory to implement complex DSP pipelines and real-time processing blocks.
• Large I/O systems  840 I/O pins enable aggregation of multiple parallel interfaces, protocol bridges, or high-channel-count data acquisition systems.
• Industrial control and instrumentation  Industrial temperature rating and robust packaging make the device suitable for control systems that require sustained operation across broad temperatures.

Unique Advantages

• Extensive programmable resources: 952,000 logic elements and ~53.25 Mbits of embedded memory provide a high degree of on-chip integration, reducing the need for external components.
• High I/O density: 840 I/Os allow flexible interfacing to sensors, serializers/deserializers, and parallel subsystems without additional multiplexing hardware.
• Industrial temperature capability: Rated from −40°C to 100°C for deployment in environments with elevated or variable temperatures.
• Low-voltage core operation: 820 mV–880 mV supply range supports low-power core designs and aligns with modern power-rail architectures.
• Compact FCBGA packaging: 1932-ball FCBGA (45×45) package balances high pin count with a compact footprint for board-space-constrained designs.
• RoHS compliant: Environmental compliance simplifies regulatory planning and procurement.

Why Choose 5SGXEABN2F45I3G?

The 5SGXEABN2F45I3G delivers a combination of very high logic capacity, substantial on-chip memory, and broad I/O count in a single FCBGA package, making it a practical choice for complex FPGA-based systems that require dense integration and robust thermal performance. As a member of the Stratix V GX family from Intel, the device aligns with established device families and documentation for electrical and switching characteristics.

This part is well suited for teams designing high-performance signal processing, large I/O aggregation, and industrial control applications where logic density, embedded memory, and operating temperature range are key selection criteria.

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