5SGXEABN2F45I2LG

The 5SGXEABN2F45I2LG is an Intel Stratix® V GX FPGA in a 1932-ball FCBGA package, built for logic-dense, I/O-intensive designs. This industrial-grade FPGA integrates a large programmable fabric, substantial on-chip memory, and a high I/O count to support complex digital systems.

Manufactured by Intel, this device is targeted at applications that require high logic capacity, extensive embedded RAM, and robust operating range with surface-mount packaging for board-level integration.

Key Features

• Logic Capacity  952,000 logic elements to implement large-scale digital logic and custom accelerators.
• Embedded Memory  Approximately 53.25 Mbits of embedded RAM for frame buffering, on-chip data storage, and algorithm state.
• I/O and Package  Up to 840 user I/O pins in a 1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount mounting simplifies PCB integration.
• Power and Voltage  Core voltage supply range of 820 mV to 880 mV to match platform power domains and regulator designs.
• Temperature and Grade  Industrial grade with operating temperature range from −40 °C to 100 °C for extended-environment deployment.
• Family-Level Electrical and I/O Characteristics  Device is part of the Stratix V GX family; family datasheet covers electrical characteristics, transceiver specifications, and programmable I/O timing.
• Regulatory Compliance  RoHS compliant, supporting lead-free manufacturing processes.

Typical Applications

• High-speed communications  Implement high-density protocol processing and board-level aggregation leveraging Stratix V GX family transceiver and I/O capabilities described in the device datasheet.
• Data and network processing  Large logic capacity and substantial on-chip RAM enable packet processing, flow control, and custom data-path acceleration.
• Compute and signal processing  Deploy DSP blocks and custom pipelines across the programmable fabric for algorithm acceleration and real-time processing.
• Board-level integration  Surface-mount 1932-FCBGA packaging and 840 I/Os facilitate dense interconnects and system-level I/O routing on multi-layer PCBs.

Unique Advantages

• High logic density: 952k logic elements provide the capacity to consolidate multiple functions into a single FPGA, reducing system BOM and board area.
• Large on-chip memory: Approximately 53.25 Mbits of embedded RAM supports deep buffering and data-intensive processing without external memory dependence.
• Extensive I/O count: 840 I/Os enable broad interface support and flexible connectivity for multi-protocol systems.
• Industrial operating range: −40 °C to 100 °C rating supports deployment in demanding thermal environments.
• Compact surface-mount FCBGA: 1932-ball FCBGA (45×45) packaging provides a high-density solution for board-level integration.
• Manufacturing and compliance: RoHS compliance aligns with modern lead-free assembly flows.

Why Choose 5SGXEABN2F45I2LG?

The 5SGXEABN2F45I2LG delivers a combination of very high logic capacity, sizeable embedded memory, and a large number of I/Os in a robust industrial-grade Stratix V GX FPGA. Its surface-mount 1932-FCBGA package and defined core voltage range simplify power and board-level design for complex systems.

This device is well suited to engineering teams building dense, high-performance digital designs that require significant on-chip resources, extensive connectivity, and operation across extended temperature ranges. Backed by Intel’s Stratix V family documentation, the part fits into workflows that rely on family-level electrical and transceiver specifications.

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