5SGXEABN2F45C3N

The 5SGXEABN2F45C3N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel. It provides a large programmable logic fabric combined with substantial on-chip embedded memory and a high I/O count, packaged in a 1932-ball BGA.

This device is designed for designs that require extensive logic capacity, abundant I/O, and carrier-grade packaging—suitable for commercial temperature applications where dense integration and system-level connectivity matter.

Key Features

• Core logic  952,000 logic elements provide extensive programmable resources for complex digital designs and large-scale integration.
• Embedded memory  Approximately 53.25 Mbits of on-chip RAM supports large buffering, state storage, and memory-intensive accelerators.
• I/O capacity  840 user I/Os enable wide parallel interfacing to external devices, high-pin-count peripherals, and multi-channel signaling.
• Transceiver options (series-level)  As part of the Stratix V GX family, the series-level datasheet documents transceiver speed grades including channel options up to 14.1 Gbps.
• Power and supply  Core voltage supply range of 820 mV to 880 mV for the device.
• Package and mounting  1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount mounting type for PCB assembly.
• Temperature and grade  Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Standards compliance  RoHS compliant.
• I/O timing documentation (series-level)  The Stratix V device documentation describes I/O timing features including programmable I/O element (IOE) delay and programmable output buffer delay.

Typical Applications

• High-density digital systems  Large logic capacity and embedded RAM enable complex packet processing, custom datapaths, and compute offload engines.
• Telecom and network equipment  High I/O count and Stratix V GX transceiver options (series-level) support multi-channel interfaces and high-bandwidth connectivity.
• Data center and acceleration  Substantial logic and on-chip memory are suitable for hardware acceleration, protocol bridging, and application-specific accelerators.
• Prototyping and system integration  Dense FPGA resources and a compact BGA package support integration of complex system functions onto a single device for validation and development.

Unique Advantages

• Large programmable fabric: 952,000 logic elements enable consolidation of multiple functions into a single device, reducing BOM and board-level complexity.
• Significant on-chip RAM: Approximately 53.25 Mbits of embedded memory supports deep buffering and stateful processing without immediate external memory dependence.
• High I/O density: 840 I/Os allow flexible interfacing to a broad set of peripherals and parallel data paths.
• Compact BGA packaging: 1932-ball FCBGA in a 45×45 supplier package footprint delivers high density in a board-level friendly form factor.
• Commercial temperature grade: Rated 0 °C to 85 °C for applications targeting commercial operating environments.
• Regulatory readiness: RoHS compliance supports current environmental regulations for electronic assemblies.

Why Choose 5SGXEABN2F45C3N?

The 5SGXEABN2F45C3N combines a very large logic element count with substantial embedded RAM and a high I/O complement in a compact 1932-BBGA package, making it well suited for commercial designs that demand dense integration and broad interfacing. As a member of the Stratix V GX family, it aligns with documented series-level transceiver and I/O timing capabilities for designs that require advanced connectivity options.

This part is appropriate for engineering teams building complex digital systems, networked equipment, or hardware accelerators that benefit from high logic density, on-chip memory, and a high pin-count package while operating within commercial temperature ranges.

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