5SGXEABN2F45I2

The 5SGXEABN2F45I2 is an Intel Stratix V GX field programmable gate array (FPGA) supplied in a 1932-ball FCBGA package. It provides a high-density programmable fabric with 952,000 logic elements, approximately 53 Mbits of embedded memory, and 840 general-purpose I/Os for complex, I/O‑heavy designs.

Engineered for industrial environments, this device operates over a –40 °C to 100 °C range and supports a low-voltage core supply between 870 mV and 930 mV, making it suitable for designs that require large-capacity logic, large on-chip RAM, and extensive external connectivity in a surface-mount FCBGA form factor.

Key Features

• Core Logic Capacity  952,000 logic elements for high-density programmable logic and large-scale system integration.
• Embedded Memory  Approximately 53 Mbits of on-chip RAM to support large buffers, frame storage, and data-path acceleration.
• I/O Density  840 I/O pins to accommodate wide parallel interfaces, multiple high-speed links, and complex board-level connectivity.
• Power and Supply  Core voltage range of 870 mV to 930 mV to match system power-architecture requirements.
• Package & Mounting  1932-ball FCBGA (45 × 45 mm) surface-mount package optimized for compact, high-pin-count board designs.
• Temperature Grade  Industrial grade with an operating temperature range of –40 °C to 100 °C for deployment in temperature-variable environments.
• Compliance  RoHS compliant, meeting common environmental requirements for electronic assemblies.

Typical Applications

• Industrial Control Systems  High logic capacity and industrial temperature rating enable integration of complex control algorithms and real-time processing on a single device.
• Communications and Networking  Large I/O count and abundant embedded RAM can support wide parallel interfaces, packet buffering, and custom protocol handling.
• Data Processing and Acceleration  Dense logic resources and on-chip memory are suited for hardware acceleration, stream processing, and algorithm prototyping.
• Test & Measurement Equipment  Extensive I/O and memory resources allow instrument designers to implement flexible front ends, data capture, and preprocessing functions.

Unique Advantages

• Massive Programmable Resource: 952,000 logic elements provide headroom for large-scale designs, reducing the need for multiple devices.
• Substantial On-Chip Memory: Approximately 53 Mbits of embedded RAM supports large buffers and deterministic, low-latency data handling.
• Very High I/O Count: 840 I/Os simplify board-level integration for systems requiring many parallel interfaces or numerous external peripherals.
• Industrial Temperature Range: Rated for –40 °C to 100 °C operation, enabling deployment in temperature-variable industrial environments.
• Compact, High-Pin FCBGA Package: The 1932-ball FCBGA (45 × 45 mm) balances pin density with a surface-mount footprint for high-performance boards.
• RoHS Compliance: Environmentally compliant for modern assembly and regulatory requirements.

Why Choose 5SGXEABN2F45I2?

The 5SGXEABN2F45I2 positions itself as a high-density, industrial-grade Stratix V GX FPGA ideal for designs that demand substantial programmable logic, large embedded memory, and extensive I/O connectivity within a compact FCBGA footprint. Its specified operating temperature range and RoHS compliance make it suitable for industrial deployments where reliability and regulatory conformance are required.

For engineering teams building complex communication, control, or data-acceleration systems, this device provides a scalable hardware platform that consolidates functionality and reduces board-level complexity, while the low-voltage core and surface-mount FCBGA package support modern power and assembly practices.

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