5SGXEABN2F45I2G

The 5SGXEABN2F45I2G is an Intel Stratix® V GX Field Programmable Gate Array (FPGA) IC delivered in a 1932‑ball FCBGA surface-mount package. This device provides 952,000 logic elements, approximately 53.25 Mbits of embedded memory, and 840 programmable I/Os for high-density, I/O‑rich designs.

Packaged for industrial use with an operating temperature range of –40°C to 100°C and a supply range of 870 mV to 930 mV, the device is RoHS compliant and intended for applications that require substantial on‑chip logic capacity and memory resources.

Key Features

• Logic Capacity  Provides 952,000 logic elements to support large, complex programmable logic designs.
• Logic Blocks  Includes 359,200 logic blocks as specified for the device architecture to help structure large designs.
• Embedded Memory  Approximately 53.25 Mbits of on‑chip RAM for buffering, lookup tables, and large data structures within the FPGA fabric.
• I/O Density  840 I/O pins to support broad external interfacing, high channel counts, and parallel connectivity.
• Power  Core supply requirement specified between 870 mV and 930 mV for device operation.
• Package & Mounting  1932‑BBGA (FCBGA) surface-mount package, supplier package listed as 1932‑FBGA, FC (45×45), suitable for board-level SMT assembly.
• Temperature & Grade  Industrial temperature grade with specified operating range of –40°C to 100°C for use in temperature-demanding environments.
• Compliance  RoHS compliant.

Typical Applications

• High‑density digital systems  Large programmable logic designs that require extensive logic elements and embedded memory.
• I/O‑intensive platforms  Systems needing large numbers of external interfaces or parallel channel connectivity, enabled by 840 I/Os.
• Industrial equipment  Deployments operating across –40°C to 100°C where industrial temperature grade components are required.

Unique Advantages

• Substantial logic resources: The 952,000 logic elements support complex, high‑function designs without immediate need for multi‑chip partitioning.
• Large on‑chip memory: Approximately 53.25 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• High I/O count: 840 I/Os simplify interfacing to numerous peripherals, sensors, or parallel data channels.
• Industrial temperature rating: Specified –40°C to 100°C operation supports deployment in demanding thermal environments.
• Compact, surface‑mount package: 1932‑BBGA (FCBGA) provides a high‑density package footprint for board designs that require many device pins in a controlled form factor.
• Regulatory compliance: RoHS compliance supports environmentally regulated designs and manufacturing processes.

Why Choose 5SGXEABN2F45I2G?

The 5SGXEABN2F45I2G delivers a combination of very high logic capacity, significant embedded memory, and a large I/O complement in a single Stratix V GX FPGA package. Its industrial temperature rating and surface‑mount 1932‑BBGA packaging make it suitable for integration into robust, space‑efficient system designs that demand programmable capability at scale.

This device is appropriate for engineering teams and procurement focused on high‑density, I/O‑rich programmable solutions that require long‑term availability and support within the Intel Stratix V family framework.

Request a quote or submit an inquiry to receive pricing, availability, and lead‑time details for the 5SGXEABN2F45I2G. Our team can provide the information you need to evaluate this FPGA for your next design.