5SGXEABN2F45C2N

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 53248000 952000 1932-BBGA, FCBGA

Quantity 1,737 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs359200Number of Logic Elements/Cells952000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXEABN2F45C2N – Stratix® V GX Field Programmable Gate Array (FPGA)

The 5SGXEABN2F45C2N is a Stratix V GX family FPGA from Intel, supplied in a 1932-BBGA (FCBGA) package for surface-mount assembly. This commercial-grade device provides a high logic capacity and substantial on-chip memory for complex, highly integrated digital designs.

With 952,000 logic elements, approximately 53.25 Mbits of embedded RAM, and 840 user I/O, this device targets applications that require significant programmable logic, extensive I/O connectivity, and on-chip buffering or memory resources.

Key Features

  • Logic Capacity: 952,000 logic elements for large-scale FPGA designs and complex logic implementation.
  • Embedded Memory: Approximately 53.25 Mbits of on-chip RAM (53,248,000 total RAM bits) to support data buffering, state storage, and memory-intensive functions.
  • I/O Count: 840 I/O pins enabling high-density connectivity with external devices and system interfaces.
  • Package & Mounting: 1932-BBGA, FCBGA package (supplier package listed as 1932-FBGA, FC (45×45)) with surface-mount mounting type.
  • Power Supply Range: Core voltage supply specified from 870 mV to 930 mV for device operation.
  • Temperature & Grade: Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance: RoHS compliant.

Typical Applications

  • High-density FPGA processing: Implement large-scale custom logic and hardware acceleration using up to 952,000 logic elements and substantial on-chip RAM.
  • Communications and transceiver-based designs: Built on the Stratix V GX family architecture, suitable for systems that leverage family-level high-speed transceiver capabilities and extensive I/O connectivity.
  • System integration and prototyping: High I/O count and large memory make this part useful for complex system prototypes and integration tasks requiring many external interfaces.

Unique Advantages

  • Large programmable fabric: 952,000 logic elements enable implementation of complex state machines, datapaths, and custom hardware accelerators without external logic.
  • Significant on-chip memory: Approximately 53.25 Mbits of embedded RAM reduce dependence on external memory for buffering and intermediate data storage.
  • Extensive I/O resource: 840 I/Os simplify board-level routing and support dense peripheral and interface integration.
  • Surface-mount, high-pin-count package: 1932-BBGA (45×45) packaging supports compact, high-density PCB designs while providing the pin count to realize complex systems.
  • Commercial-grade operating range: Rated for 0 °C to 85 °C, suitable for a wide range of controlled-environment applications.
  • Standards-compliant material set: RoHS compliance supports environmental and regulatory requirements for many assemblies.

Why Choose 5SGXEABN2F45C2N?

The 5SGXEABN2F45C2N provides a combination of high logic density, substantial embedded memory, and a large number of I/Os in a single commercial-grade Stratix V GX FPGA. These attributes make it well suited to designers who need to consolidate complex digital functions on-chip, reduce external component count, and maintain a compact board footprint.

As a member of the Stratix V GX family from Intel, this device is documented within the family datasheet and is intended for projects that demand scalable programmable logic resources, significant on-chip RAM, and extensive connectivity. It is appropriate for engineering teams focused on high-capacity FPGA implementations in controlled-temperature environments.

Request a quote or submit a purchase inquiry to obtain pricing and availability for the 5SGXEABN2F45C2N.

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