5SGXEABN2F45C2LN

The 5SGXEABN2F45C2LN is a Stratix V GX FPGA device from Intel, delivered in a 1932-BBGA (FCBGA) surface-mount package. It provides a large logic fabric, substantial embedded memory, and extensive I/O to address complex FPGA designs.

With 952,000 logic elements, approximately 53 Mbits of embedded memory, and 840 I/O pins, this device is targeted at designs that require high logic capacity, significant on-chip RAM, and broad external connectivity while operating within commercial temperature and low-voltage core ranges.

Key Features

• Logic Capacity  952,000 logic elements for implementing large, complex digital designs.
• Embedded Memory  Approximately 53 Mbits of on-chip RAM (53,248,000 bits) to support data buffering, packet processing, and large-state designs.
• I/O Density  840 user I/O pins to support high pin-count interfaces and extensive board-level connectivity.
• Fabric Blocks  359,200 logic array blocks (LABs/CLBs) to organize and optimize logic placement and routing.
• Power and Core Voltage  Core supply range of 820 mV to 880 mV, reflecting the device’s low-voltage core operation requirements.
• Package & Mounting  1932-BBGA (FCBGA) supplier package 1932-FBGA, FC (45×45); surface-mount mounting for compact, high-density board designs.
• Commercial Temperature Grade  Specified operating temperature range of 0°C to 85°C for commercial applications.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• High-density digital processing  Large logic capacity and significant embedded memory enable complex data-paths, packet processing, and protocol implementations.
• High-pin-count interface systems  Extensive I/O (840 pins) supports multi-interface boards and systems requiring broad external connectivity.
• Transceiver-enabled designs  As part of the Stratix V GX family, the device supports designs that leverage the family’s transceiver and I/O timing capabilities described in the Stratix V documentation.

Unique Advantages

• High logic density: 952,000 logic elements reduce the need for multi-device implementations for large designs.
• Substantial on-chip RAM: Approximately 53 Mbits of embedded memory helps minimize external memory dependency and simplifies board design.
• Extensive I/O: 840 I/O pins provide flexibility to connect multiple peripherals and interfaces without sacrificing board routing options.
• Compact, high-pin-count package: 1932-BBGA (45×45) offers a high I/O-to-footprint ratio suitable for space-constrained, high-density PCBs.
• Low-voltage core operation: 0.82–0.88 V supply range supports power-optimized system designs when integrated with appropriate power rails.
• Commercial temperature and RoHS compliance: Specified 0°C to 85°C operating range and RoHS conformity for standard commercial deployments.

Why Choose 5SGXEABN2F45C2LN?

The 5SGXEABN2F45C2LN positions itself where large logic capacity, significant embedded memory, and broad I/O converge in a single Stratix V GX device. Its combination of nearly one million logic elements, roughly 53 Mbits of on-chip RAM, and 840 I/Os makes it suitable for designs that consolidate complex functions onto one FPGA, simplifying board-level integration.

Backed by the Stratix V family documentation and Intel’s device specifications, this part provides a clear technical foundation for teams building high-density digital systems, transceiver-capable solutions, and multi-interface platforms that require a commercial-grade FPGA with RoHS compliance.

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