5SGXEABN1F45I2G

The 5SGXEABN1F45I2G is a Stratix® V GX Field Programmable Gate Array (FPGA) device offering large logic capacity and extensive on‑chip memory in a high‑density FCBGA package. It delivers 952,000 logic elements and approximately 53.25 Mbits of embedded RAM, combined with 840 user I/O pins and an industrial operating temperature range.

Designed for designs that require substantial programmable logic, abundant embedded memory, and a high I/O count, this device is supplied in a 1932‑BBGA (FCBGA) package for surface‑mount assembly and operates from a core supply range of 870 mV to 930 mV.

Key Features

• Logic Capacity — 952,000 logic elements to implement large, complex designs and custom processing blocks.
• Embedded Memory — Approximately 53.25 Mbits of on‑chip RAM for data buffering, FIFOs, and state storage.
• I/O Density — 840 I/O pins to support wide parallel interfaces and diverse external connectivity.
• Package & Mounting — 1932‑BBGA (FCBGA) package; supplier device package listed as 1932‑FBGA, FC (45×45); surface‑mount mounting type.
• Power Supply — Specified core voltage supply range from 870 mV to 930 mV for the device core.
• Industrial Temperature Grade — Specified operating range of −40 °C to 100 °C for deployment in industrial environments.
• Stratix V GX Series Characteristics — Part of the Stratix V GX family; series documentation lists GX transceiver speed grades as part of the Stratix V device offerings.
• RoHS Compliant — Device meets RoHS environmental compliance requirements.

Typical Applications

• High‑density FPGA implementations — Large logic capacity and substantial embedded RAM enable complex datapath and control logic integration.
• High I/O interfacing — 840 I/Os support wide buses, multi‑lane parallel interfaces, and dense board connectivity.
• Industrial systems — Industrial temperature rating (−40 °C to 100 °C) suits deployment in industrial control and instrumentation equipment.
• High‑performance prototyping — Large resource pool in a single device makes it suitable for system prototyping and integration of multiple subsystems on one FPGA.

Unique Advantages

• Massive programmable logic — 952,000 logic elements reduce the need for multiple devices when implementing large designs.
• Significant on‑chip memory — Approximately 53.25 Mbits of embedded RAM supports large buffers, lookup tables, and state machines without external memory.
• Very high I/O count — 840 I/Os enable complex board‑level integration and flexible partitioning of interfaces.
• Industrial temperature rating — Specified −40 °C to 100 °C operation supports robust performance in industrial environments.
• Compact, high‑density package — 1932‑BBGA (45×45) package provides dense routing and integration for space‑constrained designs.
• Controlled core supply range — Defined 870 mV–930 mV core supply simplifies power sequencing and design verification.

Why Choose 5SGXEABN1F45I2G?

The 5SGXEABN1F45I2G combines a very large logic fabric with substantial embedded memory and a high I/O count in a single industrial‑rated FCBGA package. Its resource levels and thermal range make it well suited to designs that require consolidation of multiple functions into one programmable device while maintaining board‑level density.

This device is appropriate for engineering teams developing complex digital systems that require scalable logic resources, plentiful on‑chip RAM, and extensive interfacing options, while meeting industrial temperature requirements and RoHS compliance.

If you would like pricing, availability, or to request a quote for the 5SGXEABN1F45I2G, submit a product inquiry or request a quote through your usual procurement channel.