5SGXEABK3H40I4G

The 5SGXEABK3H40I4G is an Intel Stratix® V GX field programmable gate array (FPGA) supplied in a 1517-BBGA FCBGA package. It combines very high logic capacity with substantial on-chip memory and a large I/O count, making it suitable for complex, high-density designs.

Key architectural highlights include 952,000 logic elements, approximately 53.2 Mbits of embedded memory, and 696 I/Os. The device is specified for industrial operation and RoHS compliant, with a core voltage range of 820 mV to 880 mV and an operating temperature range of −40 °C to 100 °C.

Key Features

• High Logic Capacity  952,000 logic elements for large-scale integration and complex programmable logic implementations.
• Embedded Memory  Approximately 53.2 Mbits of on-chip RAM to support deep buffering, state storage, and memory-intensive functions.
• Extensive I/O  696 I/O pins suitable for multi-channel interfaces, parallel connectivity, and dense board-level routing.
• Package and Mounting  1517-BBGA (FCBGA) package; supplier device package listed as 1517-HBGA (45×45). Surface mount mounting type for standard PCB assembly.
• Industrial Grade Operation  Rated for industrial temperature operation from −40 °C to 100 °C to support demanding environmental conditions.
• Core Voltage Range  Specified supply range of 820 mV to 880 mV for the device core.
• Standards Compliance  RoHS compliant.
• Documented Electrical & Switching Characteristics  Device family datasheet covers operating conditions, power, transceiver specifications, core and periphery performance, and I/O timing including programmable I/O element and output buffer delays.

Typical Applications

• High-density data processing  Leverage large logic and memory resources for packet processing, packet buffering, or custom compute pipelines.
• Multi-channel I/O systems  Support systems requiring many parallel interfaces or extensive signaling with the available 696 I/Os.
• Hardware acceleration  Implement custom accelerators and large combinational/sequential logic blocks using the high logic element count and embedded RAM.

Unique Advantages

• Large programmable capacity: 952,000 logic elements enable consolidation of complex subsystems into a single device, reducing board-level integration complexity.
• Substantial on-chip memory: Approximately 53.2 Mbits of embedded RAM reduces reliance on external memory for buffering and state storage.
• High I/O density: 696 I/Os provide flexibility for interfacing with multiple peripherals, parallel buses, or multichannel front-ends.
• Industrial temperature rating: Operation from −40 °C to 100 °C supports deployment in environments with extended temperature ranges.
• Compact FCBGA packaging: 1517-BBGA package (1517-HBGA supplier package, 45×45) balances footprint and pin density for space-constrained designs.
• Documented electrical characterization: Family datasheet includes detailed electrical and switching parameters and I/O timing information to support design validation.

Why Choose 5SGXEABK3H40I4G?

The 5SGXEABK3H40I4G positions itself where high logic density, sizeable embedded memory, and broad I/O capability are required in an industrial-grade FPGA. Its specification set—nearly one million logic elements, tens of megabits of on-chip RAM, and hundreds of I/Os—lets engineers integrate complex functions and reduce external component count.

This device is appropriate for development teams and product designs that demand a combination of integration density, documented electrical characteristics, and industrial temperature operation. RoHS compliance and standardized BGA packaging simplify manufacturing and environmental compliance considerations.

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