5SGXEABK3H40I3LG

The 5SGXEABK3H40I3LG is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1517-BBGA (FCBGA) package for surface-mount applications. It combines very large logic capacity, substantial on-chip memory, and a high I/O count to support complex, high-density digital designs.

Targeted at industrial-grade applications, this device delivers approximately 952,000 logic elements, roughly 53 Mbits of embedded RAM, and up to 696 I/O pins while operating across a core voltage range of 820 mV to 880 mV and an operating temperature range of –40 °C to 100 °C.

Key Features

• High Logic Density  Approximately 952,000 logic elements enable large-scale integration of custom logic, glue, and datapath functions on a single device.
• Embedded Memory  Approximately 53 Mbits of on-chip RAM provide local storage for buffering, state machines, and data processing tasks.
• Extensive I/O  Up to 696 I/O pins support wide parallel interfaces, multi-channel I/O and large system interconnects.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C to meet demanding environmental requirements.
• Low-Voltage Core  Core supply range of 820 mV to 880 mV for compatibility with contemporary low-voltage power rails.
• Package & Mounting  1517-BBGA (FCBGA) supplier package 1517-HBGA (45×45) in a surface-mount form factor for high-density board layouts.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.
• Series-Level Transceiver Information  As a Stratix V GX family device, the series supports multi-gigabit transceiver speed grades (series documentation lists GX channel capabilities up to 14.1 Gbps depending on speed grade).

Typical Applications

• High‑density logic consolidation  Integrate large amounts of custom logic and control functions into a single device to reduce board-level complexity.
• Data buffering and packet processing  On-chip RAM and extensive I/O allow efficient implementation of buffering, packet manipulation, and parallel data paths.
• High‑performance interfaces  High I/O count and family transceiver capabilities support multi‑lane and multi‑gigabit serial interfaces where applicable.
• Industrial systems  Industrial temperature rating and robust packaging make this device suitable for demanding embedded and industrial control environments.

Unique Advantages

• Massive on-chip resources: The combination of roughly 952k logic elements and approximately 53 Mbits of embedded RAM reduces the need for external logic and memory, simplifying designs and lowering BOM count.
• Broad I/O capacity: With up to 696 I/Os, the device supports wide parallel buses, extensive sensor and peripheral connections, and complex board-level routing.
• Industrial reliability: Rated for –40 °C to 100 °C operation to maintain functionality in harsh environments.
• Compact, manufacturable package: 1517-BBGA FCBGA with a 45×45 supplier package footprint enables high-density PCB assembly and surface-mount production processes.
• Low-voltage core operation: Core supply range of 0.82–0.88 V aligns with modern low-voltage power architectures for efficient system power design.
• Industry-standard family support: As part of the Stratix V GX family, the device benefits from series-level electrical and transceiver specifications documented for system integration and verification.

Why Choose 5SGXEABK3H40I3LG?

This Stratix V GX FPGA delivers a compelling combination of very large logic capacity, substantial embedded memory, and high I/O density in an industrial-grade, surface-mount BGA package. Its low-voltage core operation and family-level transceiver capabilities make it suitable for designers who need to consolidate complex digital functions and high-bandwidth interfaces into a single, robust device.

Choose 5SGXEABK3H40I3LG for designs that require scalable logic resources, significant on-chip memory, and dependable operation across extended temperature ranges while maintaining compact board-level integration.

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