5SGXEABK2H40I3N

The 5SGXEABK2H40I3N is a Stratix® V GX family FPGA in a 1517-BBGA (FCBGA) package designed for surface-mount PCB assembly. This device integrates high programmable logic capacity with abundant I/O and substantial on-chip RAM to support complex, high-density programmable designs.

Key device-level characteristics include 952,000 logic elements, approximately 53.25 Mbits of embedded memory, 696 I/O pins, industrial temperature grading, and a low core voltage range of 0.820–0.880 V.

Key Features

• Core Logic 952,000 logic elements provide high functional density for large-scale programmable logic implementations.
• Logic Blocks 359,200 logic blocks as specified for device fabric partitioning and resource planning.
• Embedded Memory Approximately 53.25 Mbits of on-chip RAM to support buffering, LUTRAM, and memory-intensive functions without external memory for some use cases.
• I/O Capacity 696 programmable I/O pins to support large, multi-channel interfaces and complex board-level connectivity.
• Power and Core Supply Core supply voltage range of 0.820 V to 0.880 V to match system power-rail design requirements and aid power budgeting.
• Temperature and Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in temperature-challenging environments.
• Package & Mounting 1517-BBGA (FCBGA) package, supplier device package noted as 1517-HBGA (45×45), designed for surface-mount assembly on high-density PCBs.
• RoHS Compliance Device is RoHS compliant, supporting environmentally regulated manufacturing requirements.

Unique Advantages

• High logical density: 952,000 logic elements deliver the capacity required for extensive custom logic and algorithm implementation on a single device.
• Large embedded memory: Approximately 53.25 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage needs, simplifying BOM and board design.
• Extensive I/O: 696 I/O pins enable complex multi-interface designs and broad connectivity to peripherals and high-speed board channels.
• Industrial temperature rating: −40 °C to 100 °C operating range supports deployment in thermally demanding applications.
• Compact, high-pin-count package: 1517-BBGA (FCBGA) with surface-mount mounting allows dense, board-level integration while keeping pin accessibility high.
• Controlled core supply: Defined 0.820–0.880 V core voltage simplifies power-supply design and thermal planning for system integrators.

Why Choose 5SGXEABK2H40I3N?

The 5SGXEABK2H40I3N positions itself as a high-capacity Stratix V GX FPGA option for designs requiring substantial programmable logic, significant on-chip RAM, and large I/O counts in a single FCBGA package. Its industrial temperature grade and defined core-voltage range make it suitable for designs that require robust operation across wide thermal and power conditions.

This device is well suited to engineers and teams planning large, integrated FPGA-based implementations who need to balance logic capacity, embedded memory, and I/O density while maintaining a surface-mount, high-pin-count form factor.

Request a quote or submit your requirements to receive pricing and availability information for the 5SGXEABK2H40I3N FPGA. Our team can provide lead-time details and support for your procurement and integration planning.